1-2154009-6 TE Connectivity, 1-2154009-6 Datasheet - Page 6

• Manufacturer Part Number: 1-2154009-6
• Description: CONN FEED-THRU RIGHT BLUE
• Manufacturer: TE Connectivity
• Type: Wire to Boardr

Specifications of 1-2154009-6

• Connector Type: Wire To Board
• Contact Termination: IDC / IDT
• Gender: Plug
• No. Of Contacts: 4
• No. Of Rows: 1
• Pitch Spacing: 2.5mm
• Contact Plating: Tin
• Product: IDC Connector
• Mounting Style: Wire
• Termination Style: IDC
• Current Rating: 2100 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: A101457

Rev B
3.9. Soldering
Observe guidelines and procedures when soldering contacts. Solder, clean, and dry all leads to contacts
according to the following. The connectors should be soldered using vapor phase reflow (VPR), double-sided,
non-focused infrared (IR), forced air convection, or equivalent soldering techniques. All solder joints should
conform to the Workmanship Specification 101-21 and IPC/EIA-J-STD-001.
CAUTION
NOTE
A. Flux Selection
Contacts must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the flux will
depend on the type of pc board and other components mounted on the board. Additionally, the flux must be
compatible with the wave solder line, manufacturing, health, and safety requirements. Flux that is compati-
ble with the connectors is provided in Figure 5.
B. Connectors with SMT Contacts
1. Solderability
The pc board pads must be solderable in accordance with Test Specification 109-11 (Test Method A,
non-activated rosin flux) and all other requirements for surface mount contacts specified in this document.
2. Solder Paste Characteristics
1. Alloy type shall be SAC 305; Sn 96.5/Ag 3.0/Cu 0.5.
2.Flux incorporated in the paste shall be rosin, mildly active (RMA) type.
3.Paste will be at least 80% solids by volume.
4.Mesh designation -200 to +325 (74 to 44 square micron openings, respectively).
5.Minimum viscosity of screen print shall be 5y10% cp (centipoise).
6.Minimum viscosity of stencil print shall be 7.5y10% cp (centipoise).
3. Solder Volume
Solder volume is required to be 4.27 mm
1.10 mm
4. Screen (or Stencil)
The stencil aperture shall be determined by the circuit pad size and thickness. It may be any shape as long
as it prevents solder bridging and maintains the given volume of solder paste.
C. Process
Connectors with surface mount contacts should be soldered using vapor phase (VPR), double-sided, non-
focused infrared reflow (IR) or equivalent soldering techniques. Due to many variables involved with the
reflow process (i.e., component density, orientation, etc.), it is recommended that trial runs be conducted
under actual manufacturing conditions to ensure product and process compatibility. These connectors will
withstand the temperature and exposure time specified in Figure 6.
KESTER and ALPHA are trademarks of their respective owners.
i
!
Type RMA (Mildly Activated)
No flux allowable on any of the four inner pads.
Solder volume may vary depending on solder paste composition.
3
FLUX TYPE
per driver header boardlock (calculated per 50% solid content).
ACTIVITY
3
Mild
per SMT clip solder foot, 0.57 mm
Figure 5
Noncorrosive
RESIDUE
3
KESTER
185/197
COMMERCIAL DESIGNATION
per driver header contact, and
ALPHA
611
114-13290
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