MPC8313E-RDBC Freescale Semiconductor, MPC8313E-RDBC Datasheet - Page 63
![no-image](/images/manufacturer_photos/0/2/262/freescale_semiconductor_sml.jpg)
MPC8313E-RDBC
Manufacturer Part Number
MPC8313E-RDBC
Description
BOARD CPU 8313E VER 2.2
Manufacturer
Freescale Semiconductor
Series
PowerQUICC II™ PROr
Type
MPUr
Datasheets
1.MPC8313CZQAFFB.pdf
(100 pages)
2.MPC8313E-RDBB.pdf
(52 pages)
3.MPC8313E-RDBB.pdf
(2 pages)
Specifications of MPC8313E-RDBC
Contents
Board
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
MPC8313E
- Current page: 63 of 100
- Download datasheet (2Mb)
Figure 55
19 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8313E is available in
a thermally enhanced plastic ball grid array (TEPBGAII), see
MPC8313E TEPBGAII,”
information on the TEPBGAII.
19.1
The package parameters are as provided in the following list. The package type is 27 mm × 27 mm,
516 TEPBGAII.
Freescale Semiconductor
Package outline
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
SPICLK (Output)
Package Parameters for the MPC8313E TEPBGAII
shows the SPI timing in master mode (internal clock).
Output Signals:
Note: The clock edge is selectable on SPI.
Input Signals:
(See Note)
(See Note)
SPIMISO
SPIMOSI
MPC8313E PowerQUICC
Figure 55. SPI AC Timing in Master Mode (Internal Clock) Diagram
and
Section 19.2, “Mechanical Dimensions of the MPC8313E TEPBGAII,”
t
NIIVKH
™
II Pro Processor Hardware Specifications, Rev. 3
t
NIKHOV
t
NIIXKH
27 mm × 27 mm
516
1.00 mm
2.25 mm
95.5 Sn/0.5 Cu/4 Ag (VR package),
62 Sn/36 Pb/2 Ag (ZQ package)
0.6 mm
Section 19.1, “Package Parameters for the
Package and Pin Listings
for
63
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