MPC8313E-RDBC Freescale Semiconductor, MPC8313E-RDBC Datasheet - Page 64
MPC8313E-RDBC
Manufacturer Part Number
MPC8313E-RDBC
Description
BOARD CPU 8313E VER 2.2
Manufacturer
Freescale Semiconductor
Series
PowerQUICC II™ PROr
Type
MPUr
Datasheets
1.MPC8313CZQAFFB.pdf
(100 pages)
2.MPC8313E-RDBB.pdf
(52 pages)
3.MPC8313E-RDBB.pdf
(2 pages)
Specifications of MPC8313E-RDBC
Contents
Board
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
MPC8313E
- Current page: 64 of 100
- Download datasheet (2Mb)
Package and Pin Listings
19.2
Figure 56
package.
64
Figure 56. Mechanical Dimension and Bottom Surface Nomenclature of the MPC8313E TEPBGAII
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Package code 5368 is to account for PGE and the built-in heat spreader.
Mechanical Dimensions of the MPC8313E TEPBGAII
shows the mechanical dimensions and bottom surface nomenclature of the 516-TEPBGAII
MPC8313E PowerQUICC
™
II Pro Processor Hardware Specifications, Rev. 3
Freescale Semiconductor
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