DSPIC30F5011-30I/PTG Microchip Technology, DSPIC30F5011-30I/PTG Datasheet - Page 208

16BIT MCU-DSP 30MHZ, SMD, 30F5011

DSPIC30F5011-30I/PTG

Manufacturer Part Number
DSPIC30F5011-30I/PTG
Description
16BIT MCU-DSP 30MHZ, SMD, 30F5011
Manufacturer
Microchip Technology
Series
DsPIC30Fr
Datasheet

Specifications of DSPIC30F5011-30I/PTG

Core Frequency
30MHz
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
52
Flash Memory Size
66KB
Supply Voltage Range
2.5V To 5.5V
Operating Temperature Range
-40°C To
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
dsPIC30F5011/5013
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS70116C-page 206
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-085
B
c
p
#leads=n1
Dimension Limits
E1
E
Units
CH
(F)
D1
A2
A1
E1
n1
E
D
B
n
p
A
L
c
L
n
Preliminary
MIN
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.005
.007
.025
D1
0
5
5
CH x 45
INCHES
D
NOM
A1
.020
.043
.039
.006
.024
.039
.472
.472
.394
.394
.007
.009
.035
3.5
64
16
10
10
A
MAX
.047
.010
.030
.482
.482
.398
.398
.009
.045
.041
.011
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
9.90
9.90
0.13
0.17
0.64
MILLIMETERS*
0
5
5
 2004 Microchip Technology Inc.
NOM
12.00
12.00
10.00
10.00
0.50
1.10
1.00
0.15
0.60
1.00
0.18
0.22
0.89
3.5
64
16
10
10
MAX
12.25
12.25
10.10
10.10
A2
1.20
1.05
0.25
0.75
0.23
0.27
1.14
15
15
7

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