S29AL032D90TFI000 Spansion Inc., S29AL032D90TFI000 Datasheet - Page 65

• Manufacturer Part Number: S29AL032D90TFI000
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of S29AL032D90TFI000

• Memory Size: 32Mbit
• Memory Configuration: 4M X 8
• Ic Interface Type: CFI, Parallel
• Access Time: 90ns
• Supply Voltage Range: 2.7 To 3.6 V
• Memory Case Style: TSOP
• No. Of Pins: 40
• Memory Type: Uniform Sector Flash
• Interface Type: CFI
• Rohs Compliant: Yes
• Cell Type: NOR
• Density: 32Mb
• Access Time (max): 90ns
• Boot Type: Top
• Address Bus: 22/21Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 4M/2M
• Supply Current: 35mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Compliant

20.3
January 19, 2007 S29AL032D_00_A9
PACKAGE
JEDEC
SYMBOL
SD / SE
1.00
MD
ME
A1
A2
D1
E1
A
fb
A
D
N
E
e
+0.20
-0.50
VBN048—48-Ball Fine-Pitch Ball Grid Array (FBGA) 10.0 x 6.0 mm
A1
10.00 mm x 6.00 mm NOM
0.17
0.62
0.35
MIN
---
10.00 BSC.
6.00 BSC.
5.60 BSC.
4.00 BSC.
0.80 BSC.
0.40 BSC.
PACKAGE
Ø0.50
VBN 048
NONE
NOM
N/A
---
---
---
48
---
8
6
A1 ID.
SEATING PLANE
MAX
1.00
0.73
0.45
---
D
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
D a t a
NOTE
A2
S h e e t
A
C
E
B
S29AL032D
0.08
0.10
e
C
C
NOTES:
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
6
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIAMETER IN A PLANE PARALLEL TO DATUM C.
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
Øb
Ø0.08
Ø0.15
e
H
M
M
C
C
G
A
B
F
E
D1
D
SD
C
7
B
A
6
5
4
3
2
1
3425\ 16-038.25
A1 CORNER
SE
7
E1
63