PIC24FJ256GA106-I/MR Microchip Technology, PIC24FJ256GA106-I/MR Datasheet - Page 69
![IC, 16BIT MCU, PIC24F, 32MHZ, QFN-64](/photos/12/13/121325/c04-149_mr_sml.jpg)
PIC24FJ256GA106-I/MR
Manufacturer Part Number
PIC24FJ256GA106-I/MR
Description
IC, 16BIT MCU, PIC24F, 32MHZ, QFN-64
Manufacturer
Microchip Technology
Series
PIC® 24Fr
Datasheets
1.PIC24FJ128GA008-IPT.pdf
(12 pages)
2.PIC24FJ128GA106-IPT.pdf
(14 pages)
3.PIC24FJ128GA106-IPT.pdf
(330 pages)
4.PIC24FJ128GA106-IPT.pdf
(52 pages)
5.PIC24FJ256GA106-IPT.pdf
(59 pages)
6.PIC24FJ128GB110-IPF.pdf
(292 pages)
Specifications of PIC24FJ256GA106-I/MR
Controller Family/series
PIC24
No. Of I/o's
53
Ram Memory Size
16KB
Cpu Speed
32MHz
No. Of Timers
5
Core Size
16 Bit
Program Memory Size
256KB
Peripherals
ADC, Comparator, PWM, RTC, Timer
Core Processor
PIC
Speed
32MHz
Connectivity
I²C, PMP, SPI, UART/USART
Number Of I /o
53
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-VFQFN, Exposed Pad
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
52
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240011
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARD
Eeprom Size
-
Lead Free Status / Rohs Status
Details
- PIC24FJ128GA008-IPT PDF datasheet
- PIC24FJ128GA106-IPT PDF datasheet #2
- PIC24FJ128GA106-IPT PDF datasheet #3
- PIC24FJ128GA106-IPT PDF datasheet #4
- PIC24FJ256GA106-IPT PDF datasheet #5
- PIC24FJ128GB110-IPF PDF datasheet #6
- Current page: 69 of 330
- Download datasheet (3Mb)
6.2.1
The oscillator start-up circuitry and its associated delay
timers are not linked to the device Reset delays that
occur at power-up. Some crystal circuits (especially
low-frequency crystals) will have a relatively long
start-up time. Therefore, one or more of the following
conditions is possible after SYSRST is released:
• The oscillator circuit has not begun to oscillate.
• The Oscillator Start-up Timer has not expired (if a
• The PLL has not achieved a lock (if PLL is used).
The device will not begin to execute code until a valid
clock source has been released to the system. There-
fore, the oscillator and PLL start-up delays must be
considered when the Reset delay time must be known.
6.2.2
If the FSCM is enabled, it will begin to monitor the
system clock source when SYSRST is released. If a
valid clock source is not available at this time, the
device will automatically switch to the FRC Oscillator
and the user can switch to the desired crystal oscillator
in the Trap Service Routine (TSR).
2010 Microchip Technology Inc.
crystal oscillator is used).
POR AND LONG OSCILLATOR
START-UP TIMES
FAIL-SAFE CLOCK MONITOR
(FSCM) AND DEVICE RESETS
PIC24FJ256GA110 FAMILY
6.3
Most of the Special Function Registers (SFRs) associ-
ated with the PIC24F CPU and peripherals are reset to a
particular value at a device Reset. The SFRs are
grouped by their peripheral or CPU function and their
Reset values are specified in each section of this manual.
The Reset value for each SFR does not depend on the
type of Reset with the exception of four registers. The
Reset value for the Reset Control register, RCON, will
depend on the type of device Reset. The Reset value
for the Oscillator Control register, OSCCON, will
depend on the type of Reset and the programmed
values of the FNOSC bits in Flash Configuration
Word 2 (CW2); see
NVMCON registers are only affected by a POR.
Special Function Register Reset
States
Table
6-2. The RCFGCAL and
DS39905E-page 69
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