STM32F103RFT6 STMicroelectronics, STM32F103RFT6 Datasheet - Page 98

• Manufacturer Part Number: STM32F103RFT6
• Description: MCU 32BIT 768KB FLASH 64LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103RFT6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, MMC, SPI, UART/USART, USB
• Peripherals: DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 51
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Processor Series: STM32F101xF
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 80 KB
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 36 MHz
• Number Of Programmable I/os: 112
• Number Of Timers: 15
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Operating Temperature Range: - 40 C to + 105 C
• Processor To Be Evaluated: STM32F103RF
• Supply Current (max): 28 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-11114

Electrical characteristics
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Figure 50. I
1. Measurement points are done at CMOS levels: 0.3 × V
2. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
Figure 51. I
1. Based on characterization, not tested in production.
2. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
byte.
byte.
SD transmit
SD receive
SD transmit
SD receive
WS output
WS input
CPOL = 0
CPOL = 1
CPOL = 0
CPOL = 1
2
2
S slave timing diagram (Philips protocol)
S master timing diagram (Philips protocol)
t v(WS)
t su(WS)
t w(CKH)
t w(CKH)
LSB receive
Doc ID 16554 Rev 2
LSB transmit
LSB transmit
LSB receive
t su(SD_MR)
t su(SD_SR)
t c(CK)
t c(CK)
(2)
(2)
(2)
(2)
MSB receive
DD
MSB receive
MSB transmit
MSB transmit
and 0.7 × V
t w(CKL)
t w(CKL)
t f(CK)
(1)
DD
(1)
STM32F103xF, STM32F103xG
t h(SD_MR)
.
t v(SD_MT)
t v(SD_ST)
t h(SD_SR)
Bitn receive
Bitn transmit
Bitn transmit
Bitn receive
t r(CK)
LSB receive
t h(WS)
t h(WS)
t h(SD_ST)
LSB transmit
LSB receive
t h(SD_MT)
LSB transmit
ai14884b
ai14881b