XF2L-1235-1 Omron, XF2L-1235-1 Datasheet - Page 12
![CONN FPC 12POS 0.5MM SMT](/photos/24/88/248865/4296088_sml.jpg)
XF2L-1235-1
Manufacturer Part Number
XF2L-1235-1
Description
CONN FPC 12POS 0.5MM SMT
Manufacturer
Omron
Series
XF2Lr
Specifications of XF2L-1235-1
Connector Type
Bottom Contacts
Number Of Positions
12
Pitch
0.020" (0.50mm)
Ffc, Fcb Thickness
0.30mm
Height Above Board
0.047" (1.20mm)
Mounting Type
Surface Mount, Right Angle
Cable End Type
Straight
Termination
Solder
Locking Feature
Slide Lock
Features
Zero Insertion Force (ZIF)
Contact Finish
Tin Alloy
Contact Finish Thickness
79µin (2.00µm)
Operating Temperature
-30°C ~ 85°C
Current Rating
0.500A
Voltage Rating
50V
Housing Material
Liquid Crystal Polymer (LCP)
Gender
Receptacle
Pitch Spacing
0.5mm
No. Of Contacts
12
No. Of Rows
1
Contact Plating
Gold
Ffc/fpc Thickness
0.3mm
Contact Termination
Surface Mount Vertical
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
OR683TR
XF2L12351
XF2L12351
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XF2L-1235-1A
Manufacturer:
OMRON
Quantity:
33 368
12
Rotary Backlock Mechanism with a Depth of 3.5
mm and Low Profile of 0.9 mm
• Ultra-slim connector with a depth of 3.5 mm.
• Double-sided contacts reduce the number of parts.
• Wide molding wall on the rear bottom of the connector
• Gold plated with an applicable FPC thickness of
■ Ratings and Specifications
■ Dimensions
■ Ordering Information
XF2U-@@15-3A
Rated current
Rated voltage
Contact resistance
Insulation resistance 100 M Ω min. (at 250 V DC)
Withstand voltage
Insertion tolerance
Ambient operating
temperature
Rotary Backlock Connector
(0.5-mm Pitch, Double-sided Contact)
Hold-down clip
RoHS Compliant
allows greater freedom in board design.
0.2 mm.
Slider
Pins (See note 1.)
0.4
Contact soldering dimension
Housing
Reference pin mark
0.15
11
14
20
24
27
30
32
40
4
0.12
FPC insertion dimension
0.5 ±
A
0.5 A AC/DC
50 V AC/DC
60 m Ω max. (at 20 mV max., 100 mA max.)
250 V AC for 1 min
(leakage current: 1 mA max.)
20 times
− 30 to 85 ° C (with no icing or condensation)
B
C
D
0.08
XF2U-0415-3A
XF2U-1115-3A
XF2U-1415-3A
XF2U-2015-3A
XF2U-2415-3A
XF2U-2715-3A
XF2U-3015-3A
XF2U-3215-3A
XF2U-4015-3A
Model
Contact
H
H
0.5
Hold-down
clip soldering
dimension
Pin number
indication
(3)
(Effective
interface
Quantity per reel (See note 2.)
length)
0.5±
0.5±
0.35
0.8
Applicable FPC Dimensions
0.07
0.03
0.03
(2)
(D-0.1)±
3.5
A±
3,000
0.03
0.05
(0.1)
Two,
R 0.2
1.5 min.
0.9
(1.4)
2.5 min.
0.2±
■ Materials and Finish
Housing
Slider
Contacts
Hold-down
0.03
Table of Dimensions
Note: 1. Consult your OMRON representative for inquiries
Pin Number Specifications
Refer to the following website for the latest information.
http://www.omron.co.jp/ecb/
Pins (See note 1.)
http://www.components.omron.com
3.3 ±
1.5 min.
0.05
11
14
20
24
27
30
32
40
2. Order an integer multiple of the quantity per reel.
4
0.8 ±
0.8 ±
related to pin number specifications.
0.05
0.05
PCB Mating Dimensions (Top View)
0.3 ±
0.5 ±
0.05
0.05
XF2U-0415-3A
XF2U-1115-3A
XF2U-1415-3A
XF2U-2015-3A
XF2U-2415-3A 11.5 13.5 14.0 12.6 11.8 13.1 13.9
XF2U-2715-3A 13.0 15.0 15.5 14.1 13.3 14.6 15.4
XF2U-3015-3A 14.5 16.5 17.0 15.6 14.8 16.1 16.9
XF2U-3215-3A 15.5 17.5 18.0 16.6 15.8 17.1 17.9
XF2U-4015-3A 19.5 21.5 22.0 20.6 19.8 21.1 21.9
LCP resin (UL94V-0)/natural
LCP resin (UL94V-0)/black
Spring copper alloy/nickel substrate (2 μ m),
gold-plated contacts (0.15 μ m)
Spring copper alloy/fused-tin plating (2 μ m)
Model
A ±0.05
G ±
F ±
E
0.1
0.1
1.5
5.0
6.5
9.5 11.5 12.0 10.6 9.8 11.1 11.9
A
Pattern-prohibited area
3.5
7.0
8.5
B
XF2U
(0.15)
(0.15)
(0.125)
4.0
7.5
9.0
C
(3.4)
2.6
6.1
7.6
D
1.8
5.3
6.8
E
3.1
6.6
8.1
F
3.9
7.4
8.9
G