44828-1162 Molex Inc, 44828-1162 Datasheet - Page 10

CONN RCPT 16POS .8MM RT/ANG SMD

44828-1162

Manufacturer Part Number
44828-1162
Description
CONN RCPT 16POS .8MM RT/ANG SMD
Manufacturer
Molex Inc
Series
HandyLink™ 44828r
Datasheets

Specifications of 44828-1162

Connector Style
Receptacle
Connector Type
Handylink
Number Of Positions
16
Mounting Type
Surface Mount, Right Angle
Termination
Solder
Contact Finish
Gold
Color
Black
Housing Material
Thermoplastic, High Temperature
Insulation Resistance
1000 M Ohms
Mounting Angle
Right
Operating Temperature Range
- 40 C to + 85 C
Number Of Positions / Contacts
16
Pitch
0.8 mm
Contact Plating
Gold
Contact Material
High Performance Alloy (HPA)
Gender
Female
Current Rating
1.5 A
Mounting Style
SMD/SMT
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Contact Finish Thickness
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
044828-1162
044828-1162-C
0448281162
0448281162-C
44828-1162-C
448281162
448281162-C
WM17127TR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
44828-1162
Manufacturer:
AD
Quantity:
560
Part Number:
44828-1162
Manufacturer:
MOLEX
Quantity:
44 014
REVISION:
DOCUMENT NUMBER:
A
6.2
Ingress protection, as described by IEC 60529, is a function of the customer’s enclosure. The
HandyLink™ Receptacle Connector has been designed to facilitate enclosure design when
ingress protection is required. The interfaces between the metal and plastic components of the
connector are sealed to discourage intrusion of dust and liquid through the connector into the
enclosure. The customer is expected to design an appropriate seal around the periphery of the
connector to adequately seal the finished enclosure. Contact Molex for additional information.
AS-44828-001
ECR/ECN INFORMATION:
EC No:
DATE:
Ingress Protection
Figure 4. Sealing to achieve ingress protection with the receptacle connector
6/24/04
UCP2004-2588
APPLICATION SPECIFICATION
PRELIMINARY HANDYLINK™
TITLE:
CREATED / REVISED BY:
T. Gregori/ M. Simmel
HANDYLINK™I/O CONNECTOR SYSTEM
APPLICATION SPECIFICATION
The bottom surface, once soldered, forms a
continuous seal with the PCB
Gaskets may be applied to the top and
sides, or front surfaces.
Marc Simmel
CHECKED BY:
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
APPROVED BY:
Joe Comerci
SHEET No.
10
of
21

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