44828-1162 Molex Inc, 44828-1162 Datasheet - Page 12

• Manufacturer Part Number: 44828-1162
• Description: CONN RCPT 16POS .8MM RT/ANG SMD
• Manufacturer: Molex Inc
• Series: HandyLink™ 44828r

Specifications of 44828-1162

• Connector Style: Receptacle
• Connector Type: Handylink
• Number Of Positions: 16
• Mounting Type: Surface Mount, Right Angle
• Termination: Solder
• Contact Finish: Gold
• Color: Black
• Housing Material: Thermoplastic, High Temperature
• Insulation Resistance: 1000 M Ohms
• Mounting Angle: Right
• Operating Temperature Range: - 40 C to + 85 C
• Number Of Positions / Contacts: 16
• Pitch: 0.8 mm
• Contact Plating: Gold
• Contact Material: High Performance Alloy (HPA)
• Gender: Female
• Current Rating: 1.5 A
• Mounting Style: SMD/SMT
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Contact Finish Thickness: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 044828-1162; 044828-1162-C; 0448281162; 0448281162-C; 44828-1162-C; 448281162; 448281162-C; WM17127TR

REVISION:
DOCUMENT NUMBER:
A
6.3.2 Encapsulation
AS-44828-001
The next step after soldering is to pre-seal or encapsulate the back end of the connector
and hold the wires in place using a silicone sealant or a low-pressure Macro-melt polyamide
adhesive molding. The sealant will prevent accidental shorting between adjacent terminals
and discourage intrusion of over-mold resin into the terminal and latch cavities. An
illustration of the pre-seal coverage is shown below. Care must be taken to ensure that no
encapsulant enters the terminal or latch cavities.
An alternate method is to combine one or more molded ‘covers’ to block entire sections
where void circuits are present, then use a pre-seal or encapsulant to hold the wires
separate. This is illustrated below.
NOTE: The sealant or cover should enclose the cavities under the latches, whether or not
wires are soldered to the latches. Omission of this step would allow the final over-mold resin
to extrude into cavities in the housing that could disable latch and terminal function.
ECR/ECN INFORMATION:
EC No:
DATE:
6/24/04
UCP2004-2588
APPLICATION SPECIFICATION
PRELIMINARY HANDYLINK™
TITLE:
CREATED / REVISED BY:
T. Gregori/ M. Simmel
HANDYLINK™I/O CONNECTOR SYSTEM
APPLICATION SPECIFICATION
Marc Simmel
CHECKED BY:
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
Figure 7.
Encapsulated plug
connector
Figure 8.
Covered and
encapsulated plug
connector
APPROVED BY:
Joe Comerci
SHEET No.
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