PT100MC0MP Sharp Microelectronics, PT100MC0MP Datasheet - Page 6

• Manufacturer Part Number: PT100MC0MP
• Description: TRANSISTOR, PHOTO, 900NM, SMD
• Manufacturer: Sharp Microelectronics
• Type: Phototransistorr

Specifications of PT100MC0MP

• Transistor Polarity: NPN
• Wavelength Typ: 900nm
• Power Consumption: 75mW
• Viewing Angle: 15°
• No. Of Pins: 2
• Collector Emitter Saturation Voltage Vce(sat): 0.4V
• Rise Time: 5µs
• Peak Wavelength: 900nm
• Maximum Power Dissipation: 75 mW
• Maximum Dark Current: 100 nA
• Collector- Emitter Voltage Vceo Max: 35 V
• Fall Time: 6 us
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 30 C
• Package / Case: SMD
• Voltage - Collector Emitter Breakdown (max): 35V
• Current - Collector (ic) (max): 20mA
• Current - Dark (id) (max): 100nA
• Wavelength: 900nm
• Power - Max: 75mW
• Mounting Type: Surface Mount
• Orientation: Universal
• Rohs Compliant: Yes
• Half Sensitivity Angle ±: 15°
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

■ Design Considerations
1. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant.
■ Manufacturing Guidelines
1. Sharp recommends soldering no more than once when using solder reflow methods.
2. When using solder reflow methods, follow the reflow soldering temperature profile shown in Fig. 10. Sharp rec-
3. If using an infrared lamp to preheat the parts, such heat sources may cause localized high temperatures in the
4. If hand soldering, use temperatures ≤ 240° for ≤ 3 seconds. Do not dip-solder or VPS-solder this part.
5. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
Fig. 10 Reflow Soldering Temperature Profile
240°C MAX.
165°C MAX.
1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the
2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.
3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning
4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.
Design Guidelines
Soldering Instructions
Cleaning Instructions
ommends checking the process to make sure these parameters are not exceeded; exceeding these parameters
can cause substrate bending or other mechanical stresses leading to debonding of the internal gold wires, or
other similar failure modes.
part's resin. Be sure to keep the temperature profile within the guidelines shown in Fig. 10.
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
optical characteristics.
time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-
tions to confirm the harmlessness of the ultrasonic cleaning methods.
200°C
25°C
1 to 4°C/s
120s MAX.
1 to 4°C/s
90s MAX.
10s MAX.
60s MAX.
1 to 4°C/s
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PT100MC0MPx
Sheet No.: D1-A01701EN