ACPM-7372-BLK Avago Technologies US Inc., ACPM-7372-BLK Datasheet - Page 7

• Manufacturer Part Number: ACPM-7372-BLK
• Description: 4x4mm UMTS PA Module For Band 8
• Manufacturer: Avago Technologies US Inc.
• Type: Power Amplifierr

Specifications of ACPM-7372-BLK

• Current - Supply: 560mA
• Frequency: 880MHz ~ 915MHz
• Gain: 27dB
• Package / Case: 10-SMD Module
• Rf Type: W-CDMA
• Voltage - Supply: 3.2V ~ 4.2V
• Number Of Channels: 1
• Frequency (max): 915MHz
• Power Supply Requirement: Dual
• Single Supply Voltage (min): Not RequiredV
• Single Supply Voltage (typ): Not RequiredV
• Single Supply Voltage (max): Not RequiredV
• Package Type: SMD
• Dual Supply Voltage (typ): 3.4V
• Dual Supply Voltage (max): 4.2V
• Operating Temperature Classification: Commercial
• Operating Temp Range: -20C to 85C
• Pin Count: 10
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Noise Figure: -
• P1db: -
• Test Frequency: -
• Lead Free Status / Rohs Status: Compliant

RF In
Application on mobile phone board
Application example in mobile is shown below. C4 and C5
should be placed close to pin1 and pin10. Bypass cap C1,
C2 and C3 should be also placed nearby from pin5, pin4
and pin3, respectively. The length of post-PA transmission
line should be minimized to reduce line loss.
Peripheral Circuits
7
BB
TX filter
PA_ON
PA_R0
PA_R1
C3
C9
C4
C2
ACPM-7372
C6
Ven
Vmode
Vbp
IN
Vc1
V
BATT
C1
Vcc2
GND
GND
OUT
GND
C5
output matching circuit
C7
C8
L1
Coupler
RF Out
3
4
PCB layout and part placement on phone board
PCB guideline on phone board
Note
1. To prevent voltage drop, make the bias lines as wide as possible (Pink
2. Use many via holes to fence off PA ��� input and output traces for
3. Use via holes to connect outer ground plates to internal ground
4. PA which has a ground slug requires many via holes which go through
line).
better isolation. Output signal of the PA should be isolated from
input signal and the receive signal. Output signal should not be fed
into PA input. (Green line)
planes. They help heat spread out more easily and accordingly the
board temperature can be lowered. They also help to improve ���
stability (Yellow square).
all the layers (�ed square).
1
2
Via hole