HFCT-5006 Avago Technologies US Inc., HFCT-5006 Datasheet - Page 9
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HFCT-5006
Manufacturer Part Number
HFCT-5006
Description
Fiber Optics, Evaluation Kit
Manufacturer
Avago Technologies US Inc.
Datasheet
1.AFCT-5961TGZ.pdf
(16 pages)
Specifications of HFCT-5006
Silicon Core Number
HFCT-5954xxxZ, AFCT-5961xxxZ, AFCT-5964xxxZ
Kit Contents
OC-3/OC-12 LC Evaluation Board, Associated Technical Literature
Main Purpose
Interface, Fiber Optics
Embedded
No
Utilized Ic / Part
HFCT-595x, AFCT-596x
Primary Attributes
SFF LC Singlemode for SONET/SDH, ATM Applications
Operating Voltage
3.14 V to 3.47 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Secondary Attributes
-
Lead Free Status / Rohs Status
Details
Signal Detect
The Signal Detect circuit provides a de-asserted output
signal when the optical link is broken (or when the
remote transmitter is OFF). The Signal Detect threshold
is set to transition from a high to low state between the
minimum receiver input optical power and -45 dBm
avg. input optical power indicating a definite optical
fault (e.g. unplugged connector for the receiver or
transmitter, broken fiber, or failed far-end transmitter or
data source). The Signal Detect does not detect receiver
data error or error-rate. Data errors can be determined
by signal processing offered by upstream PHY ICs.
Electromagnetic Interference (EMI)
One of a circuit board designer’s foremost concerns is
the control of electromagnetic emissions from electron-
ic equipment. Success in controlling generated Elec-
tromagnetic Interference (EMI) enables the designer to
pass a governmental agency’s EMI regulatory standard
and more importantly, it reduces the possibility of in-
terference to neighboring equipment. Avago Technolo-
gies has designed the AFCT-5961TLZ/TGZ/ATLZ/ATGZ/
DIMENSIONS IN MILLIMETERS (INCHES)
Figure 7. Recommended Board Layout Hole Pattern
9
(0.525)
(0.299)
13.34
7.59
2 x Ø 2.29 MAX.
(0.118)
3
(0.09)
(0.055 ±0.004)
2 x Ø 1.4 ±0.1
*4
(0.236)
(0.118)
6
3
(0.28)
7.11
(0.18)
4.57
(0.700)
(0.055 ±0.004)
2 x Ø 1.4 ±0.1
17.8
4 x 1.78
(0.07)
(0.121)
3.08
(0.079)
(0.14)
3.56
2
10.16
(0.4)
(0.378)
NLZ/NGZ to provide excellent EMI performance. The
EMI performance of a chassis is dependent on physical
design and features which help improve EMI suppres-
sion. Avago Technologies encourages using standard RF
suppression practices and avoiding poorly EMI-sealed
enclosures.
Avago Technologies’ OC-3 LC transceivers (AFCT-
5961TLZ/TGZ/ATLZ/ATGZ/NLZ/NGZ) have nose shields
which provide a convenient chassis connection to
the nose of the transceiver. This nose shield improves
system EMI performance by effectively closing off the
LC aperture. The recommended transceiver position,
PCB layout and panel opening for these devices are the
same, making them mechanically drop-in compatible.
Figure 8 shows the recommended positioning of the
transceivers with respect to the PCB and faceplate.
Recommended Solder and Wash Process
The AFCT-5961TLZ/TGZ/ATLZ/ATGZ/NLZ/NGZ are com-
patible with industry-standard wave solder processes.
9.59
10 x Ø 0.81 ±0.1
(0.032 ±0.004)
2 x Ø 2.29
(0.09)
(0.055 ±0.004)
4 x Ø 1.4 ±0.1
*5
(0.079)
2
NOTES:
1. THIS FIGURE DESCRIBES MSA RECOM-
2. THE HATCHED AREAS ARE KEEP-OUT
3. 2 x 5 TRANSCEIVER MODULE REQUIRES 16
*4. THE MOUNTING STUDS SHOULD BE
*5. HOLES FOR OPTIONAL HOUSING LEADS
MENDED CIRCUIT BOARD LAYOUT FOR
THE SFF TRANSCEIVER.
AREAS
STANDOFFS. NO METAL TRACES OR
GROUND CONNECTION IN KEEP-OUT
AREAS.
PCB HOLES (10 I/O PINS, 2 SOLDER POSTS
AND 4 OPTIONAL PACKAGE GROUNDING
TABS).
SHOULD BE CONNECTED TO SIGNAL
GROUND.
SOLDERED TO CHASSIS GROUND FOR
MECHANICAL INTEGRITY AND TO ENSURE
FOOTPRINT COMPATIBILITY WITH OTHER
SFF TRANSCEIVERS.
MUST BE TIED TO SIGNAL GROUND.
PACKAGE
RESERVED
GROUNDING
FOR
HOUSING
TABS