HSDL-3201#021 Lite-On Electronics, HSDL-3201#021 Datasheet - Page 11

Infrared Transceivers IR Transceiver 115.2Kb/s

HSDL-3201#021

Manufacturer Part Number
HSDL-3201#021
Description
Infrared Transceivers IR Transceiver 115.2Kb/s
Manufacturer
Lite-On Electronics
Type
TX/RXr
Datasheet

Specifications of HSDL-3201#021

Wavelength
875 nm, 880 nm
Continual Data Transmission
115.2 Kbit/s
Transmission Distance
30 cm
Radiant Intensity
9 mW/sr
Half Intensity Angle Degrees
30 deg to 60 deg
Pulse Width
2.45 us, 1.6 us
Maximum Rise Time
120 ns, 600 ns
Maximum Fall Time
80 ns, 600 ns
Led Supply Voltage
2.7 V to 6 V
Operating Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 25 C
Dimensions
8 mm x 3 mm x 2.5 mm
Data Rate
115.2Kbps
Peak Wavelength
875/880nm
Angle Of Half Sensitivity
60/30°
Communication Distance
30
Package Type
Ultra Small Profile
Fall Time
600/25ns
Rise Time
600/20ns
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Mounting
Surface Mount
Pin Count
8
Operating Temp Range
-25C to 85C
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HSDL-3201#021HSDL-3201
Manufacturer:
AVAGO
Quantity:
37 500
Company:
Part Number:
HSDL-3201#021HSDL-3201#001
Manufacturer:
AGILENT
Quantity:
250 000
Company:
Part Number:
HSDL-3201#021HSDL-3201#001
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Company:
Part Number:
HSDL-3201#021HSDL-3201#008
Manufacturer:
Agilent
Quantity:
10 000
Company:
Part Number:
HSDL-3201#021HSDL-3201#008
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Moisture Proof Packaging
The HDSL-3201 is shipped in moisture
proof packaging. Once opened,
moisture absorption begins.
This part is compliant to JEDEC Level
4.
Recommended Storage
Conditions
Storage
Temperature
Relative
Humidity
Time from Unsealing to
Soldering
After removal from the bag, the parts
should be soldered within three days
if stored at the recommended storage
conditions.
Baking
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage to
the parts.
Package
In reels
In bulk
Baking should only be done once.
11
3.
Temp.
100 C
125 C
150 C
60 C
10 C to 30 C
below 60% RH
Time
48 hours
4 hours
2 hours
1 hour
7
Recommended Land Pattern for HSDL-3201#021
(Front Options)
Recommended Land Pattern for HSDL-3201#008
(Top Options)
1.275
1.75
0.60
0.60
0.10
UNIT: mm
MOUNTING
2.20
CENTER
3.625
PITCH 7 x 0.95
0.9
0.475
1.45
MOUNTING CENTER
C L
1.425
1.35
2.375
3.325
1.25
SHIELD
SOLDER PAD
1.60
0.575
0.775
2.05
FIDUCIAL

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