HSDL-3201#021 Lite-On Electronics, HSDL-3201#021 Datasheet - Page 13
HSDL-3201#021
Manufacturer Part Number
HSDL-3201#021
Description
Infrared Transceivers IR Transceiver 115.2Kb/s
Manufacturer
Lite-On Electronics
Type
TX/RXr
Datasheet
1.HSDL-3201021.pdf
(20 pages)
Specifications of HSDL-3201#021
Wavelength
875 nm, 880 nm
Continual Data Transmission
115.2 Kbit/s
Transmission Distance
30 cm
Radiant Intensity
9 mW/sr
Half Intensity Angle Degrees
30 deg to 60 deg
Pulse Width
2.45 us, 1.6 us
Maximum Rise Time
120 ns, 600 ns
Maximum Fall Time
80 ns, 600 ns
Led Supply Voltage
2.7 V to 6 V
Operating Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 25 C
Dimensions
8 mm x 3 mm x 2.5 mm
Data Rate
115.2Kbps
Peak Wavelength
875/880nm
Angle Of Half Sensitivity
60/30°
Communication Distance
30
Package Type
Ultra Small Profile
Fall Time
600/25ns
Rise Time
600/20ns
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Mounting
Surface Mount
Pin Count
8
Operating Temp Range
-25C to 85C
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Adjacent Land Keep-Out and
Solder Mask Areas
Adjacent land keep-out is the
maximum space occupied by the unit
relative to the land pattern. There
should be no other SMD components
within this area.
The minimum solder resist strip width
required to avoid solder bridging
adjacent pads is 0.2 mm.
It is recommended that two fiducial
crosses be place at mid-length of the
pads for unit alignment.
Note: Wet/Liquid Photo-Imageable
solder resist/mask is recommended.
13
SOLDER MASK
0.2
8.2
UNITS: mm
2.6
3.0