ASDL-3212-021 Avago Technologies US Inc., ASDL-3212-021 Datasheet - Page 10

• Manufacturer Part Number: ASDL-3212-021
• Description: Infrared Transceivers SFF MIR Front w/o Shield
• Manufacturer: Avago Technologies US Inc.

Specifications of ASDL-3212-021

• Wavelength: 870 nm, 875 nm
• Continual Data Transmission: 1.152 Mbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 80 mW/sr
• Half Intensity Angle Degrees: 15 deg
• Pulse Width: 1.5 us, 1.6 us
• Maximum Rise Time: 60 ns, 600 ns
• Maximum Fall Time: 60 ns, 600 ns
• Led Supply Voltage: 0 V to 6 V
• Maximum Forward Current: 60 mA
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 7 mm x 2.73 mm x 1.64 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Recommended Re ow Pro le
The re ow pro le is a straight-line representation of
a nominal temperature pro le for a convective re ow
solder process. The temperature pro le is divided into
four process zones, each with di erent 'T/'time tem-
perature change rates. The 'T/'time rates are detailed
in the above table. The temperatures are measured at the
component to printed circuit board connections.
In process zone P1, the PC board and ASDL-3212 cas-
tellation pins are heated to a temperature of 160°C to
activate the ux in the solder paste. The temperature
ramp up rate, R1, is limited to 3°C per second to allow for
even heating of both the PC board and ASDL-3212 castel-
lations.
Process zone P2 should be of su cient time duration (60
to 120 seconds) to dry the solder paste. The temperature
is raised to a level just below the liquidus point of the
solder, usually 200°C (392°F).
10
Process Zone
Heat Up
Solder Paste Dry
Solder Re ow
Cool Down
160
120
230
220
180
255
200
25
80
0
HEAT
R1
P 1
UP
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
50
S OLDER P AS TE DRY
R2
'T
25°C to 160°C
160°C to 200°C
200°C to 255°C (260°C at 10 seconds max)
255°C to 200°C
200°C to 25°C
P 2
100
150
R3
Process zone P3 is the solder re ow zone. In zone P3,
the temperature is quickly raised above the liquidus
point of solder to 255°C (491°F) for optimum results. The
dwell time above the liquidus point of solder should be
between 20 and 60 seconds. It usually takes about 20
seconds to assure proper coalescing of the solder balls
into liquid solder and the formation of good solder con-
nections. Beyond a dwell time of 60 seconds, the inter-
metallic growth within the solder connections becomes
excessive, resulting in the formation of weak and un-
reliable connections. The temperature is then rapidly
reduced to a point below the solidus temperature of the
solder, usually 200°C (392°F), to allow the solder within
the connections to freeze solid.
Process zone P4 is the cool down after solder freeze.
The cool down rate, R5, from the liquidus point of the
solder to 25°C (77°F) should not exceed 6°C per second
maximum. This limitation is necessary to allow the PC
board and ASDL-3212 castellations to change dimensions
evenly, putting minimal stresses on the ASDL-3212 trans-
ceiver.
Ab o ve 220 C
MAX 260C
REFLOW
S OLDER
60 s e c
MAX
P 3
200
R4
COOL DOWN
Maximum 'T/'time
3°C/s
0.5°C/s
4°C/s
-6°C/s
-6°C/s
P 4
R5
250
t-TIME
(S ECONDS )
300