ASDL-3212-021 Avago Technologies US Inc., ASDL-3212-021 Datasheet - Page 11

• Manufacturer Part Number: ASDL-3212-021
• Description: Infrared Transceivers SFF MIR Front w/o Shield
• Manufacturer: Avago Technologies US Inc.

Specifications of ASDL-3212-021

• Wavelength: 870 nm, 875 nm
• Continual Data Transmission: 1.152 Mbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 80 mW/sr
• Half Intensity Angle Degrees: 15 deg
• Pulse Width: 1.5 us, 1.6 us
• Maximum Rise Time: 60 ns, 600 ns
• Maximum Fall Time: 60 ns, 600 ns
• Led Supply Voltage: 0 V to 6 V
• Maximum Forward Current: 60 mA
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 7 mm x 2.73 mm x 1.64 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Appendix A: ASDL-3212 (Option -021) SMT Assembly Application Note
Solder Pad, Mask and Metal Stencil
Recommended land pattern
Figure A2. Land Pattern
Recommended Metal Solder Stencil Aperture
It is recommended that only a 0.11mm (0.004 inch) or
a 0.127mm (0.005 inch) thick stencil be used for solder
paste printing. This is to ensure adequate printed solder
paste volume and no shorting. See the table below the
drawing for combinations of metal stencil aperture and
metal stencil thickness that should be used. Compared to
0.127mm stencil thickness 0.11mm stencil thickness has
longer length in land pattern. It is extended outwardly
from transceiver to capture more solder paste volume.
See gure 3.
11
Solder
Figure A1. Stencil and PCBA
1.75
0.10
Mask
Aperture
Stencil
Unit: mm
0.60
Mounting
Center
Pitch
0.95
C L
1.425
2.375
Land
Pattern
Metal Stencil
for Solder
Paste Printing
PCBA
0.775
fiducial
Figure A3. Solder stencil aperture
Adjacent Land Keepout and Solder Mask Areas
Adjacent land keepout is the maximum space occupied
by the unit relative to the land pattern. There should be
no other SMD components within this area. The minimum
solder resist strip width required to avoid solder bridging
adjacent pads is 0.2mm. It is recommended that two -
ducially crosses be placed at mid length of the pads for
unit alignment.
Note: Wet/Liquid Photo-imaginable solder resist/mask is recommended.
Figure A4. Adjacent Land Keepout and solder mask areas
Aperture As Per
Land Dimensions
Stencil thickness,
t (mm)
0.127mm
0.110mm
Dimension
h
l
k
j
Solder mask
h
l
mm
0.2
3.0
3.0
8.6
Aperture size (mm)
Length, l
1.75 +/- 0.05
2.40 +/- 0.05
j
Units: mm
Width, w
0.55 +/- 0.05
0.55 +/- 0.05
w
k
l
t