HSDL-3020-021 Lite-On Electronics, HSDL-3020-021 Datasheet - Page 14
HSDL-3020-021
Manufacturer Part Number
HSDL-3020-021
Description
Infrared Transceivers IR Transceiver 4.0Mb/s
Manufacturer
Lite-On Electronics
Datasheet
1.HSDL-3020-021.pdf
(24 pages)
Specifications of HSDL-3020-021
Wavelength
875 nm
Continual Data Transmission
4 Mbit/s
Transmission Distance
50 cm
Radiant Intensity
10 mW/sr
Half Intensity Angle Degrees
30 deg to 60 deg
Pulse Width
4 us, 1.6 us
Maximum Rise Time
40 ns, 600 ns
Maximum Fall Time
40 ns, 600 ns
Led Supply Voltage
0 V to 6.5 V
Maximum Forward Current
190 mA
Operating Voltage
2.4 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 25 C
Dimensions
10.4 mm x 2.95 mm x 2.5 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Recommended Metal solder Stencil Aperture
It is recommended that only a 0.152 mm (0.006 inch) or
a 0.127 mm (0.005 inch) thick stencil be used for solder
paste printing. This is to ensure adequate printed solder
paste volume and no shorting. See Table 1, below the
drawing, for combin-ations of metal stencil aperture
and metal stencil thickness that should be used. Aper-
ture opening for shield pad is 3.05 mm x 1.1 mm as per
land pattern.
Table 1.
Stencil Thickness,
t (mm)
0.127 mm
0.11 mm
Adjacent Land Keepout and Solder Mask Areas
Adjacent land keepout is the maximum space occupied
by the unit relative to the land pattern. There should be
no other SMD components within this area. The mini-
mum solder resist strip width required to avoid solder
bridging adjacent pads is 0.2 mm. It is recommended
that two fiducial crosses be placed at mid length of the
pads for unit alignment.
Note: Wet/Liquid Photo-imageable solder resist/mask is recom-
mended.
14
h
SOLDER MASK
Aperture Size (mm)
Length, l
1.75 ± 0.05
2.4 ± 0.05
j
Width, w
0.55 ± 0.05
0.55 ± 0.05
Figure 3. Solder stencil aperture.
k
l
l
APERTURES AS PER
LAND DIMENSIONS
DIMENSION
h
l
k
j
mm
0.2
3.0
3.85
11.9
w
t