HSDL-3020-021 Lite-On Electronics, HSDL-3020-021 Datasheet - Page 15
HSDL-3020-021
Manufacturer Part Number
HSDL-3020-021
Description
Infrared Transceivers IR Transceiver 4.0Mb/s
Manufacturer
Lite-On Electronics
Datasheet
1.HSDL-3020-021.pdf
(24 pages)
Specifications of HSDL-3020-021
Wavelength
875 nm
Continual Data Transmission
4 Mbit/s
Transmission Distance
50 cm
Radiant Intensity
10 mW/sr
Half Intensity Angle Degrees
30 deg to 60 deg
Pulse Width
4 us, 1.6 us
Maximum Rise Time
40 ns, 600 ns
Maximum Fall Time
40 ns, 600 ns
Led Supply Voltage
0 V to 6.5 V
Maximum Forward Current
190 mA
Operating Voltage
2.4 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 25 C
Dimensions
10.4 mm x 2.95 mm x 2.5 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Appendix B: PCB Layout Suggestion
The effects of EMI and power supply noise can poten-
tially reduce the sensitivity of the receiver, resulting in
reduced link distance. The PCB layout played an impor-
tant role to obtain a good PSRR and EM immunity re-
sulting in good electrical performance. Things to note:
1. The ground plane should be continuous under the
2. The shield trace is a wide, low inductance trace back
3. IR and RC VLED can be connected to either unfil-
4. V
5. IOV
6. Preferably a multi-layered board should be used
15
part, but should not extend under the shield trace.
to the system ground. CX1, CX2, CX3, CX4, CX5, CX6
and CX7 are optional supply filter capacitors; they
may be left out if a clean power supply is used.
tered or unregulated power supply. The bypass
capacitors should be connection before the current
limiting resistor R3 and R4 respectively. In a noisy
environment, including capacitor CX2 and CX7 can
enhance supply rejection. CX6 and CX3 that are
generally a ceramic capacitor of low inductance
providing a wide frequency response while CX2 and
CX4 are tantalum capacitor of big volume and fast
frequency response. The use of a tantalum capacitor
is more critical on the VLED line, which carries a high
current.
unregulated power supply. The Resistor, R1 together
with the capacitors, CX1 and CX2 acts as the low
pass filter.
the V
capacitor.
to provide sufficient ground plane. Use the layer
underneath and near the transceiver module as V
and sandwich that layer between ground connect-
ed board layers. The diagram below demonstrate an
example of a 4 layer board:
CC
pin can be connected to either unfiltered or
CC
CC
is connected to the ASIC voltage supply or
supply. The capacitor, CX5 acts as the bypass
CC
,
• Top Layer: Connect the metal shield and module
• Layer 2: Critical ground plane zone. 3 cm in all di-
• Layer 3: Keep data bus away from critical ground
• Bottom layer: Ground layer. Ground noise <75 mVp-
ground pin to bottom ground layer;
Place the bypass capacitors within 0.5cm from the
V
rection around the module. Connect to a clean,
noiseless ground node (eg bottom layer).
plane zone.
p. Should be separated from ground used by
noisy sources.
CC
and ground pin of the module.