GW5BTF65K00 Sharp Microelectronics, GW5BTF65K00 Datasheet - Page 13

• Manufacturer Part Number: GW5BTF65K00
• Description: LED High Power (> 0.5 Watts) 6.7W Mini Zenigata 6500K CCT
• Manufacturer: Sharp Microelectronics
• Series: Miniature Zenigatar

Specifications of GW5BTF65K00

• Led Module Type: Board + LED
• Led Color: Cool White
• Cct: 7040K
• Luminous Flux @ Test: 410lm
• Power Module Configuration: Square
• Supply Voltage: 10.2V
• Forward Current @ Test: 640mA
• Power Rating: 6.7W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

7. Precautions
① Storage conditions
② Usage conditions
③ Heat radiation
④ Installation
・Before opened: Temperature 5 ～ 30 ℃, Relative humidity less than 60 %.
・After opened: Temperature 5 ～ 30 ℃, Relative humidity less than 60 %.
・After opened LED should be kept in an aluminum moisture proof bag with a moisture
・Avoid exposing to air with corrosive gas.
・In a place with a lot of moisture, dew condensation, briny air, and corrosive gas.
・Under the direct sunlight, outdoor exposure, and in a dusty place.
・In water, oil, medical fluid, and organic solvent.
Material of board is alumina ceramic. If installed inappropriately, trouble of no radiation may occur due to
board crack or overheat. Please take particular notice for installation.
Refer to the following cautions on installation.
・ Apply thermolysis adhesive, adhesive sheet or peculiar connector when mounted on heat radiator.
・ When LED device is mechanically fixed or locked, Please take into consideration regarding the method of
・ Avoid convexly uneven boards.
・ It is recommended to apply adhesive or adhesive sheet with high thermal conductivity
・ Please take care about the influence of color change of adhesive or adhesive sheet in initial and long term
Please follow the conditions below.
This product is not designed for the use under any of the following conditions.
Please confirm performance and reliability well enough if you use under any of the following conditions;
If forward current (I
or emitting smoke.
Equip with specified heat radiator, and avoid heat stuffed inside the module.
(Before opened LED should be used within a year)
(Please apply soldering within 1 week)
absorbent material (silica gel).
If exposed, electrode surface would be damaged, which may affect soldering.
(Cl, H
In case of applying adhesive or adhesive sheet only, check the effectiveness and reliability before fixing.
If LED comes off from heat radiator, unusual temperature rise entails hazardous phenomena including
device deterioration, coming off of solder at leads, and emitting smoke.
attachment due to fail from stress.
Convex board is subject to substrate cracking or debasement of heat release.
for radiation of heat effectively.
period, which may affect light output or color due to change of reflectance from backside.
2
S, NH
3
, SO
2
F
, NO
) is applied to single-state module at any current, there is a risk of damaging LED
X,
etc.)
Model No.
GW5BTF65K00
DG-09Z030A
Page
10 of 12