FLT007A0 Lineage Power, FLT007A0 Datasheet - Page 9

• Manufacturer Part Number: FLT007A0
• Manufacturer: Lineage Power

Specifications of FLT007A0

• Operating Temperature Min Deg. C: -40C
• Operating Temperature Max Deg. C: 85C
• Rad Hardened: No
• Lead Free Status / RoHS Status: Not Compliant

Data Sheet
March 26, 2008
Figure 13. Reflow Profile for Tin/Lead (Sn/Pb)
process.
Figure 14. Time Limit Curve Above 205
for Tin Lead (Sn/Pb) process.
Lead Free Soldering
The FLT007A0-SR SMT modules are lead-free (Pb-
free) and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb
soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to
the modules and can adversely affect long-term
reliability.
LINEAGE
300
200
240
235
230
225
220
205
200
250
215
210
100
150
50
0
0
POWER
10
Heat zo ne
max 4
P reheat zo ne
max 4
P eak Temp 235
20
REFLOW TIME (S)
o
Cs
o
So ak zo ne
30-240s
Cs
-1
-1
30
o
C
40
T
205
lim
75Vdc Input Voltage Maximum, 7A Output Current Maximum
o
above
C
o
C Reflow
Co o ling
zo ne
1 -4
50
o
Cs
-1
60
FLT007A0/FLT007A0-SR Input Filter Modules
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure. 15.
MSL Rating
The FLT007A0-SR SMT modules have a MSL rating
of 1.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of <= 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Figure 15. Recommended linear reflow profile
using Sn/Ag/Cu solder.
300
250
200
150
100
50
0
Per J-STD-020 Rev. C
Heating Zone
1°C/Second
Peak Temp 260°C
Reflow Time (Seconds)
* Min. Time Above 235°C
*Time Above 217°C
15 Seconds
60 Seconds
Cooling
Zone
9