A4934GLPTR-T Allegro Microsystems Inc, A4934GLPTR-T Datasheet - Page 8

IC BLDC DVR 3PHASE 16-ETSSOP

A4934GLPTR-T

Manufacturer Part Number
A4934GLPTR-T
Description
IC BLDC DVR 3PHASE 16-ETSSOP
Manufacturer
Allegro Microsystems Inc
Datasheet

Specifications of A4934GLPTR-T

Applications
Fan Motor Driver, 3-Phase
Number Of Outputs
1
Current - Output
500mA
Voltage - Supply
8 V ~ 16 V
Operating Temperature
-40°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
16-TSSOP (0.173", 4.40mm Width) Exposed pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Load
-
Lead Free Status / RoHS Status
Supplier Unconfirmed, Lead free / RoHS Compliant
Other names
620-1382-2
A4934
mit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the
information being relied upon is current.
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
nor for any in fringe ment of patents or other rights of third parties which may result from its use.
Copyright ©2010, Allegro MicroSystems, Inc.
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to per-
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, Allegro MicroSystems, Inc. assumes no re spon si bil i ty for its use;
16X
0.10
C
0.30
0.19
1
16
A
Package LP, 16-Pin TSSOP with Exposed Thermal Pad
2
0.65 BSC
5.00±0.10
3 NOM
B
For the latest version of this document, visit our website:
Branded Face
3 NOM
0.15
0.00
4.40±0.10
SEATING
PLANE
1.20 MAX
www.allegromicro.com
6.40±0.20
C
Three-Phase Sensorless Fan Driver
A Terminal #1 mark area
B
C
For Reference Only; not for tooling use (reference MO-153 ABT)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
Reference land pattern layout (reference IPC7351
SOP65P640X110-17M);
All pads a minimum of 0.20 mm from all adjacent pads; adjust as
necessary to meet application process requirements and PCB layout
tolerances; when mounting on a multilayer PCB, thermal vias at the
exposed thermal pad land can improve thermal dissipation (reference
EIA/JEDEC Standard JESD51-5)
Exposed thermal pad (bottom surface); dimensions may vary with device
GAUGE PLANE
0.25 BSC
0.60 ±0.15
SEATING PLANE
0.20
0.09
1.00 REF
1.70
C
16
1
115 Northeast Cutoff
1.508.853.5000; www.allegromicro.com
PCB Layout Reference View
Allegro MicroSystems, Inc.
Worcester, Massachusetts 01615-0036 U.S.A.
2
0.45
3.00
3.00
0.65
6.10
8

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