A3941KLPTR-T Allegro Microsystems Inc, A3941KLPTR-T Datasheet - Page 4

• Manufacturer Part Number: A3941KLPTR-T
• Description: IC,Motor Controller,TSSOP,28PIN
• Manufacturer: Allegro Microsystems Inc

Specifications of A3941KLPTR-T

• Configuration: H Bridge
• Input Type: PWM
• Delay Time: 90ns
• Number Of Configurations: 1
• Number Of Outputs: 4
• Voltage - Supply: 5.5 V ~ 50 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP Exposed Pad, 28-eTSSOP, 28-HTSSOP
• Number Of Drivers: 4
• Driver Configuration: Non-Inverting
• Driver Type: High and Low Side
• Rise Time: 35ns
• Fall Time: 20ns
• Propagation Delay Time: 150ns
• Operating Supply Voltage (max): 50V
• Operating Supply Voltage (min): 5.5V
• Operating Temp Range: -40C to 150C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 28
• Package Type: TSSOP EP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Peak: -
• High Side Voltage - Max (bootstrap): -
• Lead Free Status / Rohs Status: Compliant
• Other names: 620-1236-2

Allegro MicroSystems, Inc. is a leader in developing, manufacturing and marketing high-performance power integrated circuits and integrated Hall-effect
magnetic sensor ICs. Allegro’s innovative solutions serve high-growth applications within the automotive, communications, computer/office automation,
consumer and industrial markets.
• Allegro’s power packages offer industry-leading
• TSSOP – Industry-standard TSSOP with optional
• QFP – Universal quad flat pack with thermal pad for
• QFN/TDFN – Quad and dual, low-profile,
Without Leads
With Leads
Please Note: Package sizes are photographed to show relative scale.
ES, EC, ET, EU, EV
(QFN with exposed pad)
Terminals: 16-48
Size: 3 x 3 mm body width to
7 x 7 mm body width
EJ (TDFN with exposed pad)
Terminals: 3-16
Size: 2 x 2 mm body to
3 x 3 mm body width
JP (QFP with exposed pad)
Terminals: 48
Size: 7 x 7 mm body width
LP (TSSOP with exposed pad)
Terminals: 16-32
Size: 4.4 mm body width
thermal performance with limited board space.
thermal pad for enhanced power dissipation
enhanced performance
surface-mount packages with thermal pad for
enhanced performance
• MSOP – Industry-standard miniature small
• SOIC – Small outline integrated circuit with some
• CSP – Wafer level chip scale
• Additional industry-standard packaging options are
LB (SOIC)
Terminals: 16-28
Size: 7.5 mm body width
LJ (SOIC with exposed pad)
Terminals: 8
Size: 3.9 mm body width
outline package
thermal pad versions for enhanced performance
available to meet individual design requirements.
Allegro Integrated Circuits
Allegro Integrated Circuits
Chip Scale
CG (Chip Scale)
Terminals: 4-12
The package options shown below are a sampling of
Allegro’s most recent, high technology packages.
For specific package information, please visit Allegro’s
website at:
www.allegromicro.com/en/Products/Packaging.
LZ (MSOP with exposed pad)
Terminals: 10
Size: 3 mm body width
Integrated Circuit
Package Portfolio
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