AD7394ARZ Analog Devices Inc, AD7394ARZ Datasheet - Page 5

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AD7394ARZ

Manufacturer Part Number
AD7394ARZ
Description
X2, 12-Bit, +3V UPwr DAC
Manufacturer
Analog Devices Inc
Datasheets

Specifications of AD7394ARZ

Settling Time
60µs
Number Of Bits
12
Data Interface
Serial
Number Of Converters
2
Voltage Supply Source
Single Supply
Power Dissipation (max)
1mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Number Of Channels
2
Resolution
12b
Conversion Rate
17KSPS
Interface Type
Serial (3-Wire)
Single Supply Voltage (typ)
3/5V
Dual Supply Voltage (typ)
Not RequiredV
Architecture
R-2R
Power Supply Requirement
Single
Output Type
Voltage
Integral Nonlinearity Error
±2LSB
Single Supply Voltage (min)
2.7V
Single Supply Voltage (max)
5.5V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
14
Package Type
SOIC N
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

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CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7394/AD7395 features proprietary ESD protection circuitry, permanent dam-
age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
Model
AD7394AN
AD7394AR
AD7395AN
AD7395AR
AD7395ARU
The AD7394/AD7395 contains 709 transistors. The die size measures 70 mil
REV. 0
ABSOLUTE MAXIMUM RATINGS*
V
V
Logic Inputs to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, +8 V
V
I
Package Power Dissipation . . . . . . . . . . . . . (T
Thermal Resistance
Maximum Junction Temperature (T
OUT
DD
REF
OUT
AD7394
AD7395
14-Lead Plastic DIP Package (N-14) . . . . . . . . . . 103 C/W
14-Lead SOIC Package (R-14) . . . . . . . . . . . . . . . 158 C/W
14-Lead Thin Shrink Surface Mount (RU-14) . . . 180 C/W
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +7 V
Short Circuit to GND . . . . . . . . . . . . . . . . . . . . . 50 mA
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
MSB
B11
D11
MSB
B9
D9
Table III. AD7395 Serial Input Register Data Format, Data Is Loaded in MSB-First Format
Table II. AD7394 Serial Input Register Data Format, Data Is Loaded in MSB-First Format
Res
(LSB)
12
12
10
10
10
JA
B10
D10
B8
D8
Temperature
Range
–40 C to +85 C
–40 C to +85 C
–40 C to +125 C
–40 C to +125 C
–40 C to +85 C
J
B9
D9
B7
D7
max) . . . . . . . . . . 150 C
B8
D8
B6
D6
J
max – T
DD
ORDERING GUIDE
+ 0.3 V
B7
D7
B5
D5
A
)/
DD
Package
Description
14-Lead P-DIP
14-Lead SOIC
14-Lead P-DIP
14-Lead SOIC
14-Lead Thin Shrink Small Outline Package (TSSOP)
JA
99 mil.
–5–
B6
D6
B4
D4
Operating Temperature Range . . . . . . . . . . . –40 C to +85 C
Storage Temperature Range . . . . . . . . . . . . –65 C to +150 C
Lead Temperature
*Stresses above those listed under Absolute Maximum Ratings
permanent damage to the device. This is a stress rating only; functional operation
of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
N-14 (Soldering, 10 sec) . . . . . . . . . . . . . . . . . . . . . . +300 C
R-14 (Vapor Phase, 60 sec) . . . . . . . . . . . . . . . . . . . . +215 C
RU-14 (Infrared, 15 sec) . . . . . . . . . . . . . . . . . . . . . . +224 C
AD7395AR and AD7395AN Only . . . . . . –40 C to +125 C
B5
D5
B3
D3
B4
D4
B2
D2
B3
D3
B1
D1
WARNING!
AD7394/AD7395
B2
D2
LSB
B0
D0
ESD SENSITIVE DEVICE
B1
D1
Package
N-14
N-14
RU-14
Options
R-14
R-14
may cause
LSB
B0
D0

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