AD9518-2ABCPZ-RL7 Analog Devices Inc, AD9518-2ABCPZ-RL7 Datasheet - Page 44
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AD9518-2ABCPZ-RL7
Manufacturer Part Number
AD9518-2ABCPZ-RL7
Description
6-Output Clock Generator With 2.8GHz
Manufacturer
Analog Devices Inc
Type
Clock Generator, Fanout Distributionr
Datasheet
1.AD9518-2ABCPZ-RL7.pdf
(64 pages)
Specifications of AD9518-2ABCPZ-RL7
Pll
Yes
Input
CMOS, LVDS, LVPECL
Output
LVPECL
Number Of Circuits
1
Ratio - Input:output
1:6
Differential - Input:output
Yes/Yes
Frequency - Max
2.33GHz
Divider/multiplier
Yes/No
Voltage - Supply
3.135 V ~ 3.465 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
48-LFCSP
Frequency-max
2.33GHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
AD9518-2
THERMAL PERFORMANCE
Table 41. Thermal Parameters for the 48-Lead LFCSP
Symbol
θ
θ
θ
θ
Ψ
Ψ
Ψ
θ
Ψ
The AD9518 is specified for a case temperature (T
that T
Use the following equation to determine the junction
temperature on the application PCB:
where:
T
T
top center of the package.
Ψ
PD is the power dissipation of the device.
JA
JMA
JMA
JB
JC
J
CASE
JB
JB
JB
JT
JT
is the junction temperature (°C).
is the value from Table 41.
T
is the case temperature (°C) measured by the user at the
CASE
J
= T
is not exceeded, an airflow source can be used.
CASE
Thermal Characteristic Using a JEDEC JESD51-7 Plus JEDEC JESD51-5 2S2P Test Board
Junction-to-ambient thermal resistance, natural convection per JEDEC JESD51-2 (still air)
Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-ambient thermal resistance, 2.5 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-board thermal resistance, natural convection per JEDEC JESD51-8 (still air)
Junction-to-board characterization parameter, natural convection per JEDEC JESD51-6 (still air)
and JEDEC JESD51-8
Junction-to-board characterization parameter, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
and JEDEC JESD51-8
Junction-to-board characterization parameter, 2.5 m/sec airflow per JEDEC JESD51-6 (moving air)
and JEDEC JESD51-8
Junction-to-case thermal resistance (die-to-heat sink) per MIL-STD-883, Method 1012.1
Junction-to-top-of-package characterization parameter, natural convection per JEDEC JESD51-2 (still air)
+ (Ψ
JT
× PD)
CASE
). To ensure
Rev. A | Page 44 of 64
Values of θ
design considerations. θ
approximation of T
where T
Values of θ
design considerations when an external heat sink is required.
Values of Ψ
design considerations.
T
J
= T
A
is the ambient temperature (°C).
A
JA
JC
JB
+ (θ
are provided for package comparison and PCB
are provided for package comparison and PCB
are provided for package comparison and PCB
JA
× PD)
J
in the following equation:
JA
can be used for a first-order
Value (°C/W)
24.7
21.6
19.4
12.9
11.9
11.8
11.6
1.3
0.5