AD9552BCPZ-REEL7 Analog Devices Inc, AD9552BCPZ-REEL7 Datasheet - Page 19

• Manufacturer Part Number: AD9552BCPZ-REEL7
• Description: Precision Clock Translator
• Manufacturer: Analog Devices Inc
• Type: Clock Generatorr

Specifications of AD9552BCPZ-REEL7

• Design Resources: Clock Distribution Circuit with Pin-Programmable Output Frequency, Output Logic Levels, and Fanout (CN0152)
• Pll: Yes
• Input: Clock, Crystal
• Output: CMOS, LVDS, LVPECL
• Number Of Circuits: 1
• Ratio - Input:output: 2:2
• Differential - Input:output: No/Yes
• Frequency - Max: 900MHz
• Divider/multiplier: Yes/No
• Voltage - Supply: 3.3V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LFCSP
• Frequency-max: 900MHz
• Number Of Elements: 1
• Pll Input Freq (min): 6.6MHz
• Pll Input Freq (max): 112.5MHz
• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Package Type: LFCSP EP
• Output Frequency Range: 0 to 900MHz
• Operating Temperature Classification: Industrial
• Pin Count: 32
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

APPLICATIONS INFORMATION
THERMAL PERFORMANCE
Table 13. Thermal Parameters for the 32-Lead LFCSP Package
Symbol
θ
θ
θ
θ
θ
Ψ
1
2
The AD9552 is specified for a case temperature (T
ensure that T
Use the following equation to determine the junction tempera-
ture on the application PCB:
where:
T
T
at the top center of the package.
Ψ
P
The exposed pad on the bottom of the package must be soldered to ground to achieve the specified thermal performance.
Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the
application to determine whether they are similar to those assumed in these calculations.
JA
JMA
JMA
JB
JC
J
CASE
D
JT
JT
is the junction temperature (°C).
is the power dissipation (see the Specifications section).
is the value indicated in Table 13.
T
is the case temperature (°C) measured by the customer
J
= T
CASE
Thermal Characteristic Using a JEDEC51-7 Plus JEDEC51-5 2S2P Test Board
Junction-to-ambient thermal resistance, 0.0 m/sec airflow per JEDEC JESD51-2 (still air)
Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-ambient thermal resistance, 2.5 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-board thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-8 (moving air)
Junction-to-case thermal resistance (die-to-heat sink) per MIL-Std 883, Method 1012.1
Junction-to-top-of-package characterization parameter, 0 m/sec airflow per JEDEC JESD51-2 (still air)
CASE
+ (Ψ
is not exceeded, an airflow source can be used.
JT
× P
D
)
CASE
). To
Rev. C | Page 19 of 32
Values of θ
considerations. θ
of T
where T
Values of θ
design considerations when an external heat sink is required.
Values of θ
design considerations.
J
T
using the following equation:
J
= T
A
is the ambient temperature (°C).
JA
A
JC
JB
are provided for package comparison and PCB design
+ (θ
are provided for package comparison and PCB
are provided for package comparison and PCB
1
JA
JA
× P
can be used for a first-order approximation
D
)
Value
40.5
35.4
31.8
23.3
4.2
0.4
AD9552
2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W