AD9866BCPZ Analog Devices Inc, AD9866BCPZ Datasheet - Page 47

IC,MODEM CIRCUIT,ANALOG FRONT END,CMOS,LLCC,64PIN,PLASTIC

AD9866BCPZ

Manufacturer Part Number
AD9866BCPZ
Description
IC,MODEM CIRCUIT,ANALOG FRONT END,CMOS,LLCC,64PIN,PLASTIC
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD9866BCPZ

Rf Type
HPNA, VDSL
Features
12-bit ADC(s), 12-bit DAC(s)
Package / Case
64-LFCSP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Frequency
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD9866BCPZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD9866BCPZRL
Manufacturer:
SAMSUNG
Quantity:
2 100
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD9866BCP
AD9866BCPRL
AD9866BCPZ
AD9866BCPZRL
AD9866CHIPS
AD9866-EB
1
Z = Pb-free part.
1
1
1.00
0.85
0.80
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
12° MAX
SEATING
PLANE
PIN 1
INDICATOR
BSC SQ
VIEW
9.00
TOP
Figure 85. 64-Lead Lead Frame Chip Scale Package (LFCSP)
0.80 MAX
0.65 TYP
0.50 BSC
* COMPLIANT TO JEDEC STANDARDS MO-220-VMMD
EXCEPT FOR EXPOSED PAD DIMENSION
Dimensions shown in millimeters
BSC SQ
0.20 REF
Rev. A | Page 47 of 48
8.75
0.05 MAX
0.02 NOM
[CP-64-3]
0.60 MAX
0.45
0.40
0.35
Package Description
64-Lead LFCSP
64-Lead LFCSP
64-Lead LFCSP
64-Lead LFCSP
DIE
Evaluation Board
48
33
49
32
0.60 MAX
(BOTTOM VIEW)
EXPOSED PAD
7.50
REF
0.30
0.25
0.18
17
64
16
1
* 7.25
7.10 SQ
6.95
0.25 MIN
PIN 1
INDICATOR
Package Option
CP-64-3
CP-64-3
CP-64-3
CP-64-3
AD9866

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