ADSP-21062LKS-133 Analog Devices Inc, ADSP-21062LKS-133 Datasheet - Page 3

• Manufacturer Part Number: ADSP-21062LKS-133
• Description: Digital Signal Processor(DSP) IC
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Floating Pointr

Specifications of ADSP-21062LKS-133

• Rohs Status: RoHS non-compliant
• Interface: Host Interface, Link Port, Serial Port
• Clock Rate: 33MHz
• Non-volatile Memory: External
• On-chip Ram: 256kB
• Voltage - I/o: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 240-MQFP, 240-PQFP
• Device Core Size: 32b
• Architecture: Super Harvard
• Format: Floating Point
• Clock Freq (max): 33MHz
• Mips: 33
• Device Input Clock Speed: 33MHz
• Ram Size: 256KB
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 3.15V
• Operating Supply Voltage (max): 3.45V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 240
• Package Type: MQFP
• Lead Free Status / Rohs Status: Not Compliant

ADSP-21060/ADSP-21060L/ADSP-21062/ADSP-21062L/ADSP-21060C/ADSP-21060LC
CONTENTS
Summary ............................................................... 1
Key Features—Processor Core .................................... 1
Processor Features (Continued) .................................. 2
Parallel Computations .............................................. 2
Up to 4M Bit On-Chip SRAM ..................................... 2
Off-Chip Memory Interfacing ..................................... 2
DMA Controller ...................................................... 2
Host Processor Interface to 16- and 32-Bit Microprocessors 2
Multiprocessing ....................................................... 2
Serial Ports ............................................................. 2
Contents ................................................................ 3
Revision History ...................................................... 3
General Description ................................................. 4
Pin Function Descriptions ........................................ 10
REVISION HISTORY
3/08—Rev. E to Rev. F
Revised Absolute Maximum Ratings ............................
Corrected model package descriptions.
See Ordering Guide..................................................
SHARC Family Core Architecture ............................ 4
Memory and I/O Interface Features ........................... 5
Development Tools ............................................... 8
Evaluation Kit ...................................................... 9
Designing an Emulator-Compatible DSP Board (Target) 9
Additional Information .......................................... 9
Target Board Connector for EZ-ICE Probe ................ 13
Rev. F | Page 3 of 64 | March 2008
20
61
ADSP-21060/ADSP-21062 Specifications ..................... 15
ADSP-21060L/ADSP-21062L Specifications ................. 18
225-Ball PBGA Ball Configurations ............................ 51
240-Lead MQFP_PQ4/CQFP Pin Configurations ........... 53
Outline Dimensions ................................................ 55
Ordering Guide ..................................................... 61
Operating Conditions (5 V) ................................... 15
Electrical Characteristics (5 V) ................................ 15
Internal Power Dissipation (5 V) ............................. 16
External Power Dissipation (5 V) ............................ 17
Operating Conditions (3.3 V) ................................. 18
Electrical Characteristics (3.3 V) ............................. 18
Internal Power Dissipation (3.3 V) .......................... 19
External Power Dissipation (3.3 V) .......................... 20
Absolute Maximum Ratings ................................... 20
ESD Caution ...................................................... 21
Package Marking Information ................................ 21
Timing Specifications ........................................... 21
Test Conditions .................................................. 47
Environmental Conditions .................................... 50
Surface-Mount Design .......................................... 60