ADSP-BF514KSWZ-4F4 Analog Devices Inc, ADSP-BF514KSWZ-4F4 Datasheet - Page 56
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ADSP-BF514KSWZ-4F4
Manufacturer Part Number
ADSP-BF514KSWZ-4F4
Description
Low-Pwr BF Proc W/flash & Cnsmr Conctvty
Manufacturer
Analog Devices Inc
Series
Blackfin®r
Type
Fixed Pointr
Datasheets
1.ADSP-BF531SBSTZ400.pdf
(12 pages)
2.ADSP-BF512KSWZ-3.pdf
(68 pages)
3.ADSP-BF514KSWZ-4F4.pdf
(72 pages)
Specifications of ADSP-BF514KSWZ-4F4
Interface
I²C, PPI, RSI, SPI, SPORT, UART/USART
Clock Rate
400MHz
Non-volatile Memory
FLASH (4Mbit)
On-chip Ram
116kB
Voltage - I/o
1.8V, 2.5V, 3.3V
Voltage - Core
1.30V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
176-LQFP Exposed Pad, 176-eLQFP, 176-HLQFP
Architecture
Modified Harvard
Format
Fixed Point
Clock Freq (max)
400MHz
Device Input Clock Speed
400MHz
Ram Size
48KB
Program Memory Size
1024KB
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
176
Package Type
LQFP EP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ADSP-BF514KSWZ-4F4
Manufacturer:
Analog Devices Inc
Quantity:
10 000
ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F
THERMAL CHARACTERISTICS
To determine the junction temperature on the application
printed circuit board use:
where:
T
T
center of package.
Ψ
P
for the method to calculate P
Values of θ
circuit board design considerations. θ
order approximation of T
where:
T
Values of θ
circuit board design considerations when an external heat sink
is required.
Values of θ
circuit board design considerations.
In
dards JESD51-2 and JESD51-6, and the junction-to-board
measurement complies with JESD51-8. The junction-to-case
measurement complies with MIL-STD-883 (Method 1012.1).
All measurements use a 2S2P JEDEC test board.
The LQFP_EP package requires thermal trace squares and ther-
mal vias to an embedded ground plane in the PCB. The paddle
must be connected to ground for proper operation to data sheet
specifications. Refer to JEDEC standard JESD51-5 for more
information.
D
J
CASE
A
JT
= Junction temperature (°C)
Table
= Power dissipation (see
= Ambient temperature (°C)
= From
= Case temperature (°C) measured by customer at top
51, airflow measurements comply with JEDEC stan-
JA
JC
JB
Table 51
are provided for package comparison and printed
are provided for package comparison and printed
are provided for package comparison and printed
T
J
T
=
J
=
T
J
CASE
T
by the equation:
Total Power Dissipation on Page 23
A
D
)
+
+
(
θ
(
JA
Ψ
JT
×
JA
P
×
can be used for a first
D
P
)
D
)
Rev. B | Page 56 of 68 | January 2011
Table 50. Thermal Characteristics for SQ-176-2 Package
Table 51. Thermal Characteristics for BC-168-1 Package
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
JA
JMA
JMA
JC
JA
JMA
JMA
JC
JT
JT
JT
JT
JT
JT
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Typical
17.4
14.8
14.0
7.8
0.28
0.39
0.48
Typical
30.5
27.6
26.3
11.1
0.20
0.35
0.45
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W