AM29F080B-90EI Spansion Inc., AM29F080B-90EI Datasheet - Page 39
![Flash Memory IC](/photos/19/5/190562/4433883_sml.jpg)
AM29F080B-90EI
Manufacturer Part Number
AM29F080B-90EI
Description
Flash Memory IC
Manufacturer
Spansion Inc.
Datasheets
1.AM29F080B-90EI.pdf
(39 pages)
2.AM29F080B-90EI.pdf
(37 pages)
3.AM29F080B-90EI.pdf
(37 pages)
4.AM29F080B-90EI.pdf
(38 pages)
Specifications of AM29F080B-90EI
Memory Size
8Mbit
Memory Configuration
1M X 8
Ic Interface Type
Parallel
Access Time
80ns
Memory Case Style
TSOP
No. Of Pins
40
Mounting Type
Surface Mount
Peak Reflow Compatible (260 C)
No
Supply Voltage Max
5.5V
Rohs Compliant
No
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AM29F080B-90EI
Manufacturer:
AMD
Quantity:
4 596
Company:
Part Number:
AM29F080B-90EI
Manufacturer:
AMD
Quantity:
4 596
Revision G+1 (January 3, 2002)
Global
Changed -75 speed option to -70 (70 ns, V
10 %). Added -55 (55 ns, V
option.
Revision G+2 (June 14, 2004)
Ordering Information
Added Pb-free OPNs.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-
templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion Inc. will not be liable
to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating
conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign
Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-
thorization by the respective government entity will be required for export of those products.
Trademarks
Copyright © 2006 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof are
trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.
Copyright © 2004–2006 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, ExpressFlash, and combinations thereof are
trademarks of Advanced Micro Devices, Inc. Product names used in this publication are for identification purposes only and may be trademarks
of their respective companies.
November 1, 2006 21503G5
CC
= 5.0 V ± 5%) speed
CC
= 5.0 ±
D A T A S H E E T
Am29F080B
Revision G3 (December 22, 2005)
Global
Deleted 150 ns speed option and reverse TSOP pack-
age option.
Revision G4 (May 19, 2006)
Added “Not recommended for new designs” note.
AC Characteristics
Changed t
Revision G5 (November 1, 2006)
Deleted “Not recommended for new designs” note.
BUSY
specification to maximium value.
37