CY62167DV30LL-55BVXIT Cypress Semiconductor Corp, CY62167DV30LL-55BVXIT Datasheet - Page 6

CY62167DV30LL-55BVXIT

CY62167DV30LL-55BVXIT

Manufacturer Part Number
CY62167DV30LL-55BVXIT
Description
CY62167DV30LL-55BVXIT
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY62167DV30LL-55BVXIT

Format - Memory
RAM
Memory Type
SRAM
Memory Size
16M (1M x 16)
Speed
55ns
Interface
Parallel
Voltage - Supply
2.2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
48-VFBGA
Density
16Mb
Access Time (max)
55ns
Sync/async
Asynchronous
Architecture
Not Required
Clock Freq (max)
Not RequiredMHz
Operating Supply Voltage (typ)
3V
Address Bus
20b
Package Type
BGA
Operating Temp Range
-40C to 85C
Number Of Ports
1
Supply Current
30mA
Operating Supply Voltage (min)
2.2V
Operating Supply Voltage (max)
3.6V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Word Size
16b
Number Of Words
1M
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Part Number
Manufacturer
Quantity
Price
Part Number:
CY62167DV30LL-55BVXIT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY62167DV30LL-55BVXIT
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Company:
Part Number:
CY62167DV30LL-55BVXIT
Quantity:
2 198
Data Retention Waveform
Switching Characteristics
Document Number : 38-05328 Rev. *I
Read Cycle
t
t
t
t
t
t
t
t
t
t
t
t
t
t
Write Cycle
t
t
t
t
t
t
t
t
t
t
t
Notes
RC
AA
OHA
ACE
DOE
LZOE
HZOE
LZCE
HZCE
PU
PD
DBE
LZBE
HZBE
WC
SCE
AW
HA
SA
PWE
BW
SD
HD
HZWE
LZWE
14. BHE.BLE is the AND of both BHE and BLE. Chip can be deselected by either disabling the chip enable signals or by disabling both BHE and BLE.
15. Test conditions for all parameters other than Tri-state parameters assume signal transition time of 1 ns/V, timing reference levels of V
16. At any given temperature and voltage condition, t
17. t
18. The internal Write time of the memory is defined by the overlap of WE, CE
Parameter
CE
BHE
to V
device.
and any of these signals can terminate a write by going INACTIVE. The data input set-up and hold timing should be referenced to the edge of the signal that terminates
the Write.
HZOE
1
CC(typ.)
V
CE
,
, t
or
BLE
CC
or
HZCE
2
, and output loading of the specified I
[18]
, t
[15]
HZBE
, and t
Read cycle time
Address to data valid
Data hold from address change
CE
OE LOW to data valid
OE LOW to LOW Z
OE HIGH to High Z
CE
CE
CE
CE
BLE/BHE LOW to data valid
BLE/BHE LOW to Low Z
BLE/BHE HIGH to HIGH Z
Write cycle time
CE
Address set-up to write end
Address hold from write end
Address set-up to write start
WE pulse width
BLE/BHE LOW to write end
Data set-up to write end
Data hold from write end
WE LOW to High-Z
WE HIGH to Low-Z
HZWE
1
1
1
1
1
1
LOW and CE
LOW and CE
HIGH and CE
LOW and CE
HIGH and CE
LOW and CE
transitions are measured when the outputs enter a high impedance state.
[14]
Over the Operating Range
2
2
2
2
2
2
[16]
[16, 17]
[16, 17]
[16]
HIGH to data valid
HIGH to Low Z
HIGH to Power-up
HIGH to write end
LOW to High Z
LOW to Power-down
V
OL
t
HZCE
CC
CDR
/I
Description
OH
, min.
[16]
is less than t
as shown in the “AC Test Loads and Waveforms” section.
[16, 17]
[16]
[16, 17]
LZCE
DATA RETENTION MODE
, t
HZBE
1
= V
IL
is less than t
, BHE and/or BLE = V
V
DR
> 1.5 V
LZBE
, t
HZOE
Min
IL
55
10
10
10
55
40
40
40
40
25
10
5
0
0
0
0
, and CE
is less than t
55 ns
2
Max
55
55
25
20
20
55
55
20
20
= V
LZOE
IH
CY62167DV30 MoBL
V
. All signals must be ACTIVE to initiate a write
CC
, and t
t
R
, min.
Min
70
10
10
10
70
60
60
45
60
30
10
5
0
0
0
0
HZWE
70 ns
CC(typ)
is less than t
Max
70
70
35
25
25
70
70
25
25
/2, input pulse levels of 0
LZWE
Page 6 of 17
for any given
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns

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