CY7C1339G-133AXI Cypress Semiconductor Corp, CY7C1339G-133AXI Datasheet - Page 4

SRAM (Static RAM)

CY7C1339G-133AXI

Manufacturer Part Number
CY7C1339G-133AXI
Description
SRAM (Static RAM)
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1339G-133AXI

Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
4M (128K x 32)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3.15 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Part Number:
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Quantity:
10 000
Pin Definitions
Document Number: 38-05520 Rev. *I
A
BW
BW
GW
BWE
CLK
CE
CE
CE
0
, A
1
2
3
Name
A
C
, BW
, BW
1
, A
B
D
synchronous
synchronous
synchronous
synchronous
synchronous
synchronous
synchronous
Input-
Input-
Input-
Input-
Input-
Input-
Input-
Input-
clock
I/O
M
A
B
C
D
E
G
H
K
N
P
R
U
F
J
L
T
Address inputs used to select one of the 128 K address locations. Sampled at the rising edge
of the CLK if ADSP or ADSC is active LOW, and CE
are fed to the two-bit counter. .
Byte write select inputs, active LOW. Qualified with BWE to conduct byte writes to the SRAM.
Sampled on the rising edge of CLK.
Global write enable input, active LOW. When asserted LOW on the rising edge of CLK, a global
write is conducted (all bytes are written, regardless of the values on BW
Byte write enable input, active LOW. Sampled on the rising edge of CLK. This signal must be
asserted LOW to conduct a byte write.
Clock input. Used to capture all synchronous inputs to the device. Also used to increment the
burst counter when ADV is asserted LOW, during a burst operation.
Chip enable 1 input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with
CE
when a new external address is loaded.
Chip enable 2 input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction with
CE
loaded.
Chip enable 3 input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with
CE
loaded. Not connected for BGA. Where referenced, CE
document for BGA.
2
1
1
and CE
and CE
and CE
NC/288M
NC/144M
V
V
V
V
V
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
NC
NC
DDQ
DDQ
DDQ
DDQ
DDQ
1
C
C
C
C
D
D
D
D
2
3
3
to select/deselect the device. ADSP is ignored if CE
to select/deselect the device. CE
to select/deselect the device. CE
NC/72M
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
CE
V
NC
NC
NC
A
A
A
2
DD
2
C
C
C
C
D
D
D
D
119-ball BGA Pinout
MODE
BW
BW
V
V
V
V
V
V
V
V
NC
NC
A
A
A
A
3
SS
SS
SS
SS
SS
SS
SS
SS
D
c
ADSC
ADSP
BWE
ADV
CLK
V
CE
V
V
GW
NC
OE
NC
NC
A1
A0
A
4
DD
DD
DD
Description
1
3
2
is sampled only when a new external address is
is sampled only when a new external address is
BW
BW
V
V
V
V
V
V
V
V
NC
NC
NC
5
A
A
A
A
SS
SS
SS
SS
SS
SS
SS
SS
1
, CE
B
A
3
is assumed active throughout this
2
, and CE
NC/36M
NC/9M
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
V
NC
NC
NC
A
A
A
6
DD
B
B
B
B
A
A
A
A
1
is HIGH. CE
3
NC/576M
are sampled active. A1, A0
NC/1G
V
V
V
V
V
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
NC
ZZ
[A:D]
DDQ
DDQ
DDQ
DDQ
DDQ
7
B
B
B
B
A
A
A
A
and BWE).
1
is sampled only
CY7C1339G
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