CY7C1381D-133AXI Cypress Semiconductor Corp, CY7C1381D-133AXI Datasheet - Page 19

• Manufacturer Part Number: CY7C1381D-133AXI
• Description: IC,SYNC SRAM,512KX36,CMOS,QFP,100PIN,PLASTIC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1381D-133AXI

• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Memory Size: 18M (512K x 36)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 428-2147; CY7C1381D-133AXI

AC Test Loads and Waveforms
Capacitance
Thermal Resistance
Note:
Document #: 38-05544 Rev. *F
19. Tested initially and after any design or process change that may affect these parameters.
C
C
C
Θ
Θ
Parameter
Parameter
3.3V IO Test Load
IN
CLK
IO
2.5V IO Test Load
OUTPUT
OUTPUT
JA
JC
Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Z
Z
[19]
0
0
= 50Ω
= 50Ω
Description
Description
(a)
(a)
V
V
[19]
T
T
= 1.25V
= 1.5V
R
R
L
L
= 50Ω
= 50Ω
OUTPUT
OUTPUT
T
V
V
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, in accordance with
EIA/JESD51.
3.3V
2.5V
A
DD
DDQ
= 25°C, f = 1 MHz,
INCLUDING
INCLUDING
= 3.3V.
JIG AND
= 2.5V
JIG AND
SCOPE
Test Conditions
Test Conditions
SCOPE
5 pF
5 pF
(b)
(b)
R = 317Ω
R = 1667Ω
R = 351Ω
R = 1538Ω
100 TQFP
100 TQFP
Package
Package
28.66
4.08
V
5
5
5
GND
GND
V
DDQ
DDQ
≤ 1 ns
≤ 1 ns
CY7C1381D, CY7C1381F
CY7C1383D, CY7C1383F
10%
10%
119 BGA
119 BGA
Package
Package
23.8
6.2
8
8
8
ALL INPUT PULSES
ALL INPUT PULSES
90%
90%
165 FBGA
165 FBGA
Package
Package
(c)
(c)
20.7
4.0
9
9
9
Page 19 of 29
90%
90%
10%
10%
°C/W
°C/W
Unit
Unit
pF
pF
pF
≤ 1 ns
≤ 1 ns