CY7C65620-56LFXAT Cypress Semiconductor Corp, CY7C65620-56LFXAT Datasheet - Page 25
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CY7C65620-56LFXAT
Manufacturer Part Number
CY7C65620-56LFXAT
Description
CY7C65620-56LFXAT
Manufacturer
Cypress Semiconductor Corp
Datasheet
1.CY7C65620-56LFXAT.pdf
(29 pages)
Specifications of CY7C65620-56LFXAT
Lead Free Status / Rohs Status
Compliant
Package Diagram
The CY7C65620/CY7C65630 is available in a space saving 56-pin QFN (8 × 8 mm).
Thermal Impedance for the package
Document Number: 38-08037 Rev. *T
56-pin QFN
Package
LASER MARK
PIN 1 DOT
1.
2. REFERENCE JEDEC#: MO-220
3. PACKAGE WEIGHT: 0.162G
4. ALL DIMENSIONS ARE IN MILLIMETERS
NOTES:
1
4
HATCH AREA IS SOLDERABLE EXPOSED METAL.
1
1
5
5
6
18.4 °C/W
Figure 7. 56-pin QFN 8 × 8 mm LF56A (Subcon Punch Type with 6.1 × 6.1 EPad)
Typical
TOP VIEW
8.000±0.100
JA
2.1 °C/W
4
3
2
8
Typical
Figure 6. 56-pin Sawn QFN (8 × 8 × 1.00 mm)
4
2
2
9
JC
SIDE VIEW
0
0.900±0.100
0.200 REF.
+0.05
-0
0.400±0.100
0.25
+0.05
-0.07
4
2
2
9
SOLDERABLE
4
3
2
8
EXPOSED
SOLDERABLE
PAD
EXPOSED
6.500±0.100
CY7C65620/CY7C65630
BOTTOM VIEW
6.100 REF
PAD
0.50 PITCH
51-85144 *I
5
6
1
5
51-85187 *E
1
1
4
0.45 REF
R 0.20
PIN #1 ID
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