CY8C20160-SX2IT Cypress Semiconductor Corp, CY8C20160-SX2IT Datasheet - Page 19

• Manufacturer Part Number: CY8C20160-SX2IT
• Description: CY8C20160-SX2IT
• Manufacturer: Cypress Semiconductor Corp
• Series: CapSense Express™ CY8C20xxxr

Specifications of CY8C20160-SX2IT

• Controller Type: Capacitive Sensing Controller
• Interface: I²C
• Voltage - Supply: 2.4 V ~ 5.25 V
• Current - Supply: 1.5mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (3.9mm Width)
• Processor Series: CY8C201xx
• Core: M8C
• Development Tools By Supplier: CY3218-CAPEXP1
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 6. Recommended Layout Guidelines and Best Practices (continued)
Document Number: 001-54606 Rev. *E
9
10
11
12
13
14
15
16
17
18
19
20
21
22
Sl
Trace routing
Via position for the sensors
Via hole size for sensor traces
Number of vias on sensor trace
CapSense series resistor
placement
Distance between any
CapSense trace to ground flood
Device placement
Placement of components in
2-layer PCB
Placement of components in
4-layer PCB
Overlay thickness-buttons
Overlay material
Overlay adhesives
LED back lighting
Board thickness
Category
10-mil
0 mm
Min
–
–
–
1
–
–
–
–
–
–
–
–
10 mm
20-mil
2 mm
Max
–
–
–
2
–
–
–
–
–
–
–
Traces should be routed on the non sensor side. If any non
CapSense trace crosses CapSense trace, ensure that
intersection is orthogonal.
Via should be placed near the edge of the button/slider to
reduce trace length thereby increasing sensitivity.
10-mil
1
Place CapSense series resistors close to PSoC for noise
suppression. CapSense resistors have highest priority place
them first.
20-mil
Mount the device on the layer opposite to sensor. The
CapSense trace length between the device and sensors
should be minimum
Top layer – sensor pads and bottom layer – PSoC, other
components, and traces.
Top layer – sensor pads, second layer – CapSense traces,
third layer – hatched ground, bottom layer – PSoC, other
components, and non CapSense traces
1 mm
Should to be non conductive material. Glass, ABS plastic,
Formica
Adhesive should be non conductive and dielectrically
homogenous. 467MP and 468MP adhesives made by 3M are
recommended.
Cut a hole in the sensor pad and use rear mountable LEDs.
Refer the PCB layout below.
Standard board thickness for CapSense FR4 based designs
is 1.6 mm.
Recommendations/Remarks
CY8C20160, CY8C20140
CY8C20110, CY8C20180
CY8C20142
Page 19 of 39
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