DSPIC33FJ16MC102-I/SP Microchip Technology, DSPIC33FJ16MC102-I/SP Datasheet - Page 307

• Manufacturer Part Number: DSPIC33FJ16MC102-I/SP
• Description: 16-bit Motor Control DSC Family, 16 MIPS, 16KB Flash, 1KB RAM 28 SPDIP .300in TU
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ16MC102-I/SP

• Processor Series: dsPIC33F
• Core: dsPIC
• Data Bus Width: 16 bit
• Program Memory Type: Flash
• Program Memory Size: 16 KB
• Interface Type: SPI, I2C, UART, JTAG
• Number Of Programmable I/os: 35
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Development Tools By Supplier: MPLAB IDE Software
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 13 Channel
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 21
• Flash Memory Size: 16KB
• Supply Voltage Range: 3V To 3.6V
• Operating Temperature Range: -40°C To +85°C
• Digital Ic Case Style: DIP
• No. Of Pins: 28
• Rohs Compliant: Yes
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 16 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 21
• Eeprom Size: -
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Lead Free Status / Rohs Status: Details

© 2011 Microchip Technology Inc.
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
dsPIC33FJ16GP101/102 AND dsPIC33FJ16MC101/102
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
1
2
A1
EXPOSED
E
Preliminary
A
NOTE 1
PAD
Units
A1
A3
E2
D2
N
A
E
D
K
e
b
L
E2
1
2
0.80
0.00
3.65
3.65
0.23
0.50
0.20
MIN
N
MILLIMETERS
BOTTOM VIEW
0.65 BSC
6.00 BSC
6.00 BSC
0.20 REF
NOM
0.90
0.02
3.70
3.70
0.30
0.55
D2
28
–
Microchip Technology Drawing C04-105B
MAX
1.00
0.05
4.20
4.20
0.35
0.70
–
L
DS70652C-page 307
b
K
e