TISP61060P-S Bourns Inc., TISP61060P-S Datasheet - Page 13

• Manufacturer Part Number: TISP61060P-S
• Description: Sidacs
• Manufacturer: Bourns Inc.

Specifications of TISP61060P-S

• Mounting Style: Through Hole
• Package / Case: PDIP-8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will
withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high
humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
NOTES: A. Leads are within 0.25 (0.010) radius of true position at maximum material condition.
SEPTEMBER 1995 — REVISED MARCH 2006
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
D008 Plastic Small-outline Package
D008
(0.228 - 0.244)
(0.053 - 0.069)
DIMENSIONS ARE:
1.35 - 1.75
TISP61060 Gated Protector Series
5.80 - 6.20
B. Body dimensions do not include mold flash or protrusion.
C. Mold flash or protrusion shall not exceed 0.15 (0.006).
D. Lead tips to be planar within ±0.051 (0.002).
(0.004 - 0.008)
0.102 - 0.203
(0.150 - 0.157)
(0.011 - 0.031)
0.28 - 0.79
3.81 - 4.00
MILLIMETERS
(INCHES)
INDEX
1
8
7 ° NOM
3 Places
(0.189 - 0.197)
4.80 - 5.00
2
7
(see Note A)
Pin Spacing
6 places
(0.050)
1.27
6
3
(0.010 - 0.020)
0.25 - 0.50
MECHANICAL DATA
(0.014 - 0.020)
5
4
0.36 - 0.51
8 Places
x 45 ° N0M
(0.0075 - 0.0090)
0.190 - 0.229
8-pin Small Outline Microelectronic Standard
Package MS-012, JEDEC Publication 95
(0.181 - 0.205)
7 ° NOM
4 Places
4.60 - 5.21
(0.020 - 0.044)
0.51 - 1.12
4 ° ± 4 °
MDXXAA E