TISP61060P-S Bourns Inc., TISP61060P-S Datasheet - Page 15

• Manufacturer Part Number: TISP61060P-S
• Description: Sidacs
• Manufacturer: Bourns Inc.

Specifications of TISP61060P-S

• Mounting Style: Through Hole
• Package / Case: PDIP-8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NOTES: A. Each pin centerline is located within 0.25 (0.010) of its true longitudinal position.
This dual-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will
withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high
humidity conditions The package is intended for insertion in mounting-hole rows on 7.62 (0.300) centers. Once the leads are compressed and
inserted, sufficient tension is provided to secure the package in the board during soldering. Leads require no additional cleaning or processing
when used in soldered assembly.
“TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office.
“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.
SEPTEMBER 1995 — REVISED MARCH 2006
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
P008 - Plastic Dual-In-Line Package
DIMENSIONS ARE:
P008
Notch
Index
TISP61060 Gated Protector Series
B. Dimensions fall within JEDEC MS001 - R-PDIP-T, 0.300" Dual-In-Line Plastic Family.
C. Details of the previous dot index P008 package style, drawing reference MDXXABA, are given in the earlier publications.
(.015 - .021)
0.38 - 0.53
8 Places
MILLIMETERS
(INCHES)
1
8
(.364 - .384)
9.25 - 9.75
2
7
6
3
4 Places
(.070)
1.78
MAX.
5
4
(see Note A)
6 Places
(.100)
(.020)
2.54
0.51
(.240 - .260)
6.10 - 6.60
TYP.
MIN.
MECHANICAL DATA
(.200)
(.125)
5.08
3.17
MAX.
MIN.
Seating
Plane
(.008 - .014)
0.20 - 0.36
(.300 - .324)
(.330 - .370)
7.62 - 8.23
8.38 - 9.40
MDXXCF