BAT60JFILM STMicroelectronics, BAT60JFILM Datasheet - Page 4

• Manufacturer Part Number: BAT60JFILM
• Description: DIODE SCHOTTKY 10V 3A SOD-323
• Manufacturer: STMicroelectronics

Specifications of BAT60JFILM

• Voltage - Forward (vf) (max) @ If: 580mV @ 1A
• Voltage - Dc Reverse (vr) (max): 10V
• Current - Average Rectified (io): 3A (DC)
• Current - Reverse Leakage @ Vr: 6µA @ 10V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Mounting Type: Surface Mount
• Package / Case: SOD-323
• Product: Schottky Diodes
• Peak Reverse Voltage: 10 V
• Forward Continuous Current: 3 A
• Max Surge Current: 5 A
• Configuration: Single
• Forward Voltage Drop: 0.58 V at 1 A
• Maximum Reverse Leakage Current: 7.5 uA
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Capacitance @ Vr, F: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-3707-2

BAT60J
Fig. 9: Thermal resistance junction to ambient ver-
sus copper surface (epoxy printed circuit board FR4,
copper thickness: 35 m).
600
550
500
450
400
350
300
250
200
150
100
4/5
Fig. 6: Reverse leackage current versus junction
temperature (typical values).
Fig. 8-1: Forward voltage drop versus forward cur-
rent (High level).
1E+5
1E+4
1E+3
1E+2
1E+0
1E+1
1E+0
1E-1
1E+1
1E-1
0
0.0
Rth(j-a) (°C/W)
IFM(A)
0
IR[Tj] / IR[Tj=25°C]
VR=8V
10
0.2
(Typical values)
25
Tj=150°C
20
0.4
30
0.6
50
(Typical values)
40
Tj=80°C
S(Cu) (mm²)
0.8
VFM(V)
(Maximum values)
Tj(°C)
50
75
Tj=25°C
1.0
60
100
1.2
70
1.4
80
125
IF=0.75A
1.6
90
150
100
1.8
Fig. 7: Junction capacitance versus reverse voltage
applied (typical values).
100
Fig. 8-2: Forward voltage drop versus forward cur-
rent (Low level).
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
10
0.0
1
C(pF)
IFM(A)
0.1
(Typical values)
0.2
Tj=80°C
(Typical values)
0.3
Tj=150°C
VR(V)
0.4
VFM(V)
0.5
0.6
(Maximum values)
Tj=25°C
0.7
F=1MHz
Tj=25°C
0.8
10