RSX301L-30TE25 Rohm Semiconductor, RSX301L-30TE25 Datasheet
RSX301L-30TE25
Specifications of RSX301L-30TE25
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RSX301L-30TE25 Summary of contents
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... Taping specifications (Unit : mm) 2.0±0.05 4.0±0.1 2.9±0.1 4.0±0.1 Limits Symbol FSM Tj -40 to +150 Tstg Min. Typ. Max 0. 200 RSX301L-30 Land size figure (Unit : mm) 2.0 PMDS Structure 0.3 φ1.55±0.05 φ1.55 2.8MAX Unit ℃ 150 ℃ Conditions Unit V I =3.0A F µA V ...
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... DISPERSION MAP Mounted on epoxy board 1000 IM=100mA IF=1A Rth(j-a) 100 time 1ms 300us Rth(j- 0.1 100 0.001 0.01 0 100 TIME:t(s) Rth-t CHARACTERISTICS RSX301L-30 1000 f=1MHz 100 REVERSE VOLTAGE:VR(V) VR-Ct CHARACTERISTICS 850 Ta=25℃ 840 f=1MHz 830 VR=0V n=10pcs 820 810 ...
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... R=0Ω R=1.5kΩ ESD DISPERSION MAP D=t/T VR=15V Tj=150℃ Sin(θ＝180 D=1 100 125 150 AMBIENT TEMPERATURE:Ta(℃) Derating Curveﾞ(Io-Ta) RSX301L- D=t/T 6 VR=15V Tj=150℃ 100 125 150 CASE TEMPARATURE:Tc(℃) Derating Curveﾞ(Io-Tc) 3/3 Rev.D ...
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Appendix No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM CO.,LTD. The content specified herein is subject to change for improvement without notice. The content specified herein is for the ...