UPA2450BTL-E1-A Renesas Electronics America, UPA2450BTL-E1-A Datasheet - Page 9

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UPA2450BTL-E1-A

Manufacturer Part Number
UPA2450BTL-E1-A
Description
MOSFET N-CH DUAL 20V 6-HWSON
Manufacturer
Renesas Electronics America
Datasheet

Specifications of UPA2450BTL-E1-A

Fet Type
2 N-Channel (Dual)
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
17.5 mOhm @ 4A, 4.5V
Drain To Source Voltage (vdss)
20V
Current - Continuous Drain (id) @ 25° C
8.6A
Vgs(th) (max) @ Id
1.5V @ 1mA
Gate Charge (qg) @ Vgs
8nC @ 4V
Input Capacitance (ciss) @ Vds
520pF @ 10V
Power - Max
700mW
Mounting Type
Surface Mount
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPA2450BTL-E1-A
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Company:
Part Number:
UPA2450BTL-E1-A
Quantity:
6 000
5. This device is very thin device and should be handled with caution for mechanical stress. The rate of distortion
Note 1. Definition of rate of distortion(written as ε in this document)
applied to the device should become below 2000
characteristic of a device may be degraded and it may result in failure.
2. The relation of the distortion and the bend changes with several conditions, such as a size of substrate and
ε = (l − l
l
l: Distance above-mentioned when receiving stress.
so on.
0
: Distance for two arbitrary points before receiving stress.
0
)/l
The substrate that mounted the device is on a stand with a support width of 24 mm.
The device is turned downward. The stress is applied from a top.
0
Support width 24 mm
6000
5000
4000
3000
2000
1000
0
Figure 3. Example of the bend and the rate of distortion
0
Stress
0.2
Figure 2. Direction of substrate and stress
Bend - mm
0.4
Data Sheet G16635EJ1V0DS
0.6
µ
ε.
Note1
0.8
If the rate of distortion exceeds 2000
Substrate: 33 x 6 mm, t = 0.5 mm, FR-4
The direction of a device:
Measurement position
Device
1
Recommended condition
Bend
Note2
µ
ε, the
µ
PA2450B
7

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