NTMC1300R2 ON Semiconductor, NTMC1300R2 Datasheet

NTMC1300R2

Manufacturer Part Number

NTMC1300R2

Description

MOSFET N/P-CH DUAL 3A 30V 8SOIC

Manufacturer

ON Semiconductor

Datasheet

1.NTMC1300R2.pdf (9 pages)

Specifications of NTMC1300R2

Fet Type

N and P-Channel

Fet Feature

Logic Level Gate

Rds On (max) @ Id, Vgs

90 mOhm @ 3A, 10V

Drain To Source Voltage (vdss)

30V

Current - Continuous Drain (id) @ 25° C

2.2A, 1.8A

Vgs(th) (max) @ Id

2.2V @ 250µA

Gate Charge (qg) @ Vgs

5nC @ 4.5V

Input Capacitance (ciss) @ Vds

300pF @ 20V

Power - Max

Mounting Type

Surface Mount

Package / Case

8-SOIC (3.9mm Width)

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant

Other names

NTMC1300R2OS

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NTMC1300R2

Power MOSFET

3 Amps, 30 Volts

Complementary SO−8 Dual

Features

•

Applications

•

1. When surface mounted to an FR−4 board using minimum recommended pad

2. When surface mounted to an FR−4 board using 1″ pad size, (Cu Area

3. When surface mounted to an FR−4 board using 1″ pad size, (Cu Area

August, 2006 − Rev. 1

MAXIMUM RATINGS

Drain−to−Source Voltage

Gate−to−Source Voltage − Continuous

Drain Current − Continuous (Note 1)

Drain Current − Continuous (Note 2)

Drain Current − Continuous (Note 3)

Drain Current − Pulsed

Total Power Dissipation @ T

(Note 3)

Operating and Storage

Single Pulse Drain−to−Source Avalanche

Energy − Starting T

Thermal Resistance

Maximum Lead Temperature for

Soldering Purposes for 10 Seconds

Computers, Printers, Cellular and Cordless Phones

Drives, Tape Drives

Ultra Low R

Higher Efficiency Extending Battery Life

Miniature SO−8 Surface Mount Package

DC−DC Converters

Power Management in Portable and Battery Powered Products, i.e.:

Low Voltage Motor Controls in Mass Storage Products, i.e.: Disk

size, (Cu Area 0.412 in

0.412 in

N−Channel

P−Channel

N−Channel

P−Channel

N−Channel

P−Channel

N−Channel

P−Channel

Temperature Range

= 2.45 Apk, L = 25 mH, RG = 25 W)

Junction−to−Ambient (Note 1)

Junction−to−Ambient (Note 2)

Junction−to−Ambient (Note 3)

= 20 Vdc, V

), Steady State.

), T ≤ 10 Seconds.

DS(on)

Rating

= 10 Vdc,

= 25°C

), Steady State.

= 25°C unless otherwise noted)

= 25°C

Symbol

DSS

, T

qJA

stg

−65 to

Value

178.5

62.5

±20

150

106

260

2.2

1.8

2.8

2.3

3.6

3.0

8.5

7.0

2.0

°C/W

Unit

Adc

Apk

°C

NTMC1300R2

100 mW @ V

73 mW @ V

Device

Source−1

Source−2

3 AMPERES, 30 VOLTS

Gate−1

Gate−2

N−Channel

ORDERING INFORMATION

EC1300

PIN ASSIGNMENT

http://onsemi.com

(N−Channel)

(P−Channel)

Package

SO−8, Dual

CASE 751

STYLE 11

(Top View)

SO−8

Publication Order Number:

= Device Code

= Location Code

= Year

= Work Week

= 10 V (Typ)

2500/Tape & Reel

NTMC1300R2/D

P−Channel

Drain−1

Drain−2

Shipping

MARKING

DIAGRAM

EC1300

LYWW

Related parts for NTMC1300R2

NTMC1300R2 Summary of contents

Page 1

... EC1300 = Device Code L = Location Code Y = Year WW = Work Week PIN ASSIGNMENT Source−1 Drain− Gate− Drain−1 Source−2 Drain− Gate−2 Drain−2 (Top View) ORDERING INFORMATION Device Package Shipping SO−8 2500/Tape & Reel Publication Order Number: NTMC1300R2/D ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Drain−Source Breakdown Voltage (V GS Zero Gate Voltage Drain Current ( Vdc Vdc 25° Gate−Body Leakage Current (V = ±20 Vdc CHARACTERISTICS ...

Page 3

TYPICAL ELECTRICAL CHARACTERISTICS N−Channel 12 4 25° 5.2 V 6 DRAIN−TO−SOURCE ...

Page 4

TYPICAL ELECTRICAL CHARACTERISTICS N−Channel 0. 25°C J 0.16 0.12 0.08 0. DRAIN CURRENT (AMPS) D Figure 7. On−Resistance versus Drain Current and Gate Voltage 1 3 ...

Page 5

N−Channel 500 iss 400 C rss 300 200 100 GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE (VOLTS) Figure 13. Capacitance Variation 5 Q ...

Page 6

N−Channel 25° 0.4 0.6 0 SOURCE−TO−DRAIN VOLTAGE (VOLTS) SD Figure 19. Diode Forward Voltage versus Current ...

Page 7

INFORMATION FOR USING THE SO−8 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure ...

Page 8

For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones and a figure for belt speed. Taken together, these control settings ...

Page 9

... S 5.80 6.20 0.228 0.244 STYLE 11: PIN 1. SOURCE 1 2. GATE 1 3. SOURCE 2 4. GATE 2 5. DRAIN 2 6. DRAIN 2 7. DRAIN 1 8. DRAIN 1 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NTMC1300R2/D ...

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