NTMC1300R2 ON Semiconductor, NTMC1300R2 Datasheet - Page 7

• Manufacturer Part Number: NTMC1300R2
• Description: MOSFET N/P-CH DUAL 3A 30V 8SOIC
• Manufacturer: ON Semiconductor

Specifications of NTMC1300R2

• Fet Type: N and P-Channel
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 90 mOhm @ 3A, 10V
• Drain To Source Voltage (vdss): 30V
• Current - Continuous Drain (id) @ 25° C: 2.2A, 1.8A
• Vgs(th) (max) @ Id: 2.2V @ 250µA
• Gate Charge (qg) @ Vgs: 5nC @ 4.5V
• Input Capacitance (ciss) @ Vds: 300pF @ 20V
• Power - Max: 2W
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: NTMC1300R2OS

design. The footprint for the semiconductor packages must
be the correct size to ensure proper solder connection
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and
• When preheating and soldering, the temperature of the
Surface mount board layout is a critical portion of the total
The melting temperature of solder is higher than the rated
soldering should be 100°C or less.*
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference shall be a maximum of 10°C.
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
INFORMATION FOR USING THE SO−8 SURFACE MOUNT PACKAGE
0.024
0.6
0.275
7.0
SOLDERING PRECAUTIONS
http://onsemi.com
7
interface between the board and the package. With the
correct pad geometry, the packages will self−align when
subjected to a solder reflow process.
• The soldering temperature and time shall not exceed
• When shifting from preheating to soldering, the
• After soldering has been completed, the device should
• Mechanical stress or shock should not be applied
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
260°C for more than 10 seconds.
maximum temperature gradient shall be 5°C or less.
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
during cooling.
0.060
0.155
1.52
4.0
0.050
1.270
inches
mm