NTHD4401PT1G ON Semiconductor, NTHD4401PT1G Datasheet

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NTHD4401PT1G

Manufacturer Part Number
NTHD4401PT1G
Description
MOSFET PWR P-CH DUAL20V CHIPFET
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTHD4401PT1G

Fet Type
2 P-Channel (Dual)
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
155 mOhm @ 2.1A, 4.5V
Drain To Source Voltage (vdss)
20V
Current - Continuous Drain (id) @ 25° C
2.1A
Vgs(th) (max) @ Id
1.2V @ 250µA
Gate Charge (qg) @ Vgs
6nC @ 4.5V
Input Capacitance (ciss) @ Vds
300pF @ 10V
Power - Max
1.1W
Mounting Type
Surface Mount
Package / Case
8-ChipFET™
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NTHD4401PT1GOS
NTHD4401PT1GOS
NTHD4401PT1GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTHD4401PT1G
Manufacturer:
ON Semiconductor
Quantity:
150
NTHD4401P
Power MOSFET
−20 V, −3.0 A, Dual P−Channel, ChipFETt
Features
Applications
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.27 in sq
MAXIMUM RATINGS
THERMAL RESISTANCE RATINGS
© Semiconductor Components Industries, LLC, 2005
November, 2005 − Rev. 4
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Pulsed Drain Current
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
Junction−to−Ambient − Steady State (Note 1)
Junction−to−Ambient − t v 5 s
Transfer is Required
Portable Equipment
Low R
Leadless ChipFET Package 40% Smaller Footprint than TSOP−6
ChipFET Package with Excellent Thermal Capabilities where Heat
Pb−Free Package is Available
Charge Control in Battery Chargers
Optimized for Battery and Load Management Applications in
MP3 Players, Cell Phones, Digital Cameras, PDAs
Buck and Boost DC−DC Converters
[1 oz] including traces).
DS(on)
and Fast Switching Speed in a ChipFET Package
Rating
Rating
(T
t v 5 s
t v 5 s
Steady
Steady
J
State
State
= 25°C unless otherwise noted)
tp = 10 ms
T
T
T
T
T
T
A
A
A
A
A
A
= 25°C
= 85°C
= 25°C
= 25°C
= 85°C
= 25°C
Symbol
Symbol
T
V
R
J
V
I
P
, T
T
DSS
I
DM
I
qJA
GS
D
S
D
L
stg
−55 to
Value
Value
"12
−2.1
−1.5
−3.0
−9.0
−2.5
−20
150
260
110
1.1
0.6
2.1
60
1
°C/W
Unit
Unit
°C
°C
W
V
V
A
A
A
G
NTHD4401PT1
NTHD4401PT1G
†For information on tape and reel specifications,
1
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
D
D
D
D
V
CONNECTIONS
1
1
2
2
(BR)DSS
−20 V
P−Channel MOSFET
Device
8
7
6
5
ORDERING INFORMATION
PIN
S
C4 = Specific Device Code
M
G
1
http://onsemi.com
= Month Code
= Pb−Free Package
130 mW @ −4.5 V
200 mW @ −2.5 V
D
1
2
3
4
1
R
(Pb−Free)
Package
ChipFET
ChipFET
DS(on)
S
G
S
G
1
2
1
2
Publication Order Number:
G
TYP
2
1
2
3
4
CASE 1206A
P−Channel MOSFET
MARKING
DIAGRAM
ChipFET
STYLE 2
3000/Tape & Reel
3000/Tape & Reel
Shipping
NTHD4401P/D
S
2
I
D
−3.0 A
MAX
D
2
8
7
6
5

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NTHD4401PT1G Summary of contents

Page 1

... T 260 L Symbol Value Unit °C/W R 110 qJA 60 Device NTHD4401PT1 NTHD4401PT1G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 1 http://onsemi.com R TYP I MAX DS(on) D 130 mW @ −4.5 V −3.0 A 200 mW @ − ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage Drain−to−Source Breakdown Voltage Tem- perature Coefficient Zero Gate Voltage Drain Current Gate−to−Source Leakage Current ON CHARACTERISTICS (Note 2) Gate Threshold Voltage Gate Threshold Temperature Coefficient Drain−to−Source On Resistance Forward Transconductance CHARGES, CAPACITANCES ...

Page 3

TYPICAL PERFORMANCE CURVES − − −2 −2 −1 −1 −1.4 V −1 −V , DRAIN−TO−SOURCE ...

Page 4

TYPICAL PERFORMANCE CURVES 10000 150°C J 1000 T = 100°C J 100 −V , DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 7. Drain−to−Source Leakage Current vs. Voltage 6 ...

Page 5

... SCALE 20:1 0.026 Figure 13. Basic *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. The basic pad layout with dimensions is shown in Figure 13. This is sufficient for low power dissipation MOSFET ...

Page 6

... N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 6 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. ...

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