ispGDX160V-7B208 Lattice, ispGDX160V-7B208 Datasheet - Page 18

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ispGDX160V-7B208

Manufacturer Part Number
ispGDX160V-7B208
Description
Analog & Digital Crosspoint ICs USE ispGDX2
Manufacturer
Lattice
Datasheet

Specifications of ispGDX160V-7B208

Maximum Dual Supply Voltage
3.6 V
Minimum Dual Supply Voltage
2.3 V, 3 V
Mounting Style
SMD/SMT
Number Of Arrays
1
Operating Supply Voltage
2.5 V, 3.3 V
Supply Type
Dual
Configuration
Programmable
Package / Case
FPBGA-208
Input Level
TTL
Output Level
TTL
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Product
Digital Crosspoint
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ISPGDX160V-7B208
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Company:
Part Number:
ISPGDX160V-7B208
Quantity:
376
Part Number:
ispGDX160V-7B208I
Manufacturer:
NXP
Quantity:
3 702
3-state levels are measured 0.5V from steady-state
active level.
Output Load Conditions
1. One output at a time for a maximum duration of one second. V
2. Typical values are at V
3. I
4. For a typical application with 50% of I/O pins used as inputs, 50% used as outputs or bidirectionals.
5. This parameter limits the total current sinking of I/O pins surrounding the nearest GND pin.
SYMBOL
Switching Test Conditions
DC Electrical Characteristics
V
V
I
I
I
I
I
I
I
I
I
I
I
I
IL
IH
IL-PU
BHLS
BHHS
BHLO
BHHO
BHT
OS
CCQ
CC
CONT
Input Pulse Levels
Input Rise and Fall Time
Input Timing Reference Levels
Output Timing Reference Levels
Output Load
degradation. Characterized but not 100% tested.
e.g. An input driving four I/O cells at 40 MHz results in a dynamic I
OL
OH
CC
A
B
C
D
1
/ MHz = (0.01 x I/O cell fanout) + 0.04
4
TEST CONDITION
5
Active High
Active Low
Active High to Z
at V -0.5V
Active Low to Z
at V +0.5V
Slow Slew
Output Low Voltage
Output High Voltage
Input or I/O Low Leakage Current
Input or I/O High Leakage Current
I/O Active Pull-Up Current
Bus Hold Low Sustaining Current
Bus Hold High Sustaining Current
Bus Hold Low Overdrive Current
Bus Hold High Overdrive Current
Bus Hold Trip Points
Output Short Circuit Current
Quiescent Power Supply Current
Dynamic Power Supply Current
per Input Switching
Maximum Continuous I/O Pin Sink
Current Through Any GND Pin
OH
OL
PARAMETER
CC
= 3.3V and T
153Ω
153Ω
153Ω
Over Recommended Operating Conditions
R1
≤ 1.5ns 10% to 90%
A
See figure at right
= 25
GND to 3.0V
134Ω
134Ω
134Ω
R2
o
1.5V
1.5V
C.
I
I
0V ≤ V
V
0V ≤ V
V
V
0V ≤ V
0V ≤ V
V
V
One input toggling @ 50% duty cycle,
outputs open.
OL
OH
CC
IN
IN
CC
IL
Table 2-0004A
=24 mA
=-12 mA
= 0.5V, V
= V
= V
≤ V
= 3.3V, V
35pF
35pF
35pF
35pF
5pF
5pF
CL
IN
IN
IN
IN
IL
IH
IN
(Max.)
≤ V
≤ V
(Min.)
≤ V
≤ V
≤ 5.25V
17
IL
IL
CC
CC
CONDITION
IH
OUT
(Max.)
OUT
= V
= 0.5V, T
*
CC
= 0.5V was selected to avoid test problems by tester ground
Device
Output
CC
C L includes Test Fixture and Probe Capacitance.
Specifications ispGDX160V
of approximately ((0.01 x 4) + 0.04) x 40 = 3.2 mA.
A
= 25˚C
+ 3.3V
MIN.
V
2.4
-50
50
IL
R 1
R 2
TYP.
Note 3
See
70
2
C L
MAX.
0.55
-150
-550
-250
V
*
550
-10
10
96
IH
mA/MHz
Point
UNITS
Test
mA
mA
mA
µA
µA
µA
µA
µA
µA
µA
V
V
V

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