RJU003N03T106 Rohm Semiconductor, RJU003N03T106 Datasheet

MOSFET N-CH 30V 300MA SOT-323

RJU003N03T106

Manufacturer Part Number
RJU003N03T106
Description
MOSFET N-CH 30V 300MA SOT-323
Manufacturer
Rohm Semiconductor
Datasheet

Specifications of RJU003N03T106

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
1.1 Ohm @ 300mA, 4.5V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
300mA
Vgs(th) (max) @ Id
1.5V @ 1mA
Input Capacitance (ciss) @ Vds
24pF @ 10V
Power - Max
200mW
Mounting Type
Surface Mount
Package / Case
SC-70-3, SOT-323-3
Transistor Polarity
N Channel
Continuous Drain Current Id
300mA
Drain Source Voltage Vds
30V
On Resistance Rds(on)
1.1ohm
Rds(on) Test Voltage Vgs
4.5V
Voltage Vgs Max
12V
Operating Temperature
RoHS Compliant
Configuration
Single
Resistance Drain-source Rds (on)
1.1 Ohm @ 4.5 V
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
+/- 12 V
Continuous Drain Current
0.3 A
Power Dissipation
200 mW
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Gate Charge (qg) @ Vgs
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
RJU003N03T106TR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
RJU003N03T106
Manufacturer:
ROHM/罗姆
Quantity:
20 000
2.5V Drive Nch MOSFET
Silicon N-channel MOSFET
1) Low On-resistance.
2) Low voltage drive (2.5V drive).
Switching
∗1 Pw≤10µs, Duty cycle≤1%
∗2 Each terminal mounted on a recommended land
∗ Each terminal mounted on a recommended land
Drain-source voltage
Gate-source voltage
Drain current
Total power dissipation
Channel temperature
Range of storage temperature
Channel to ambient
c
www.rohm.com
Type
RJU003N03
Structure
Features
Applications
Packaging specifications and h
Absolute maximum ratings (Ta=25°C)
Thermal resistance
RJU003N03
2009 ROHM Co., Ltd. All rights reserved.
Package
Code
Basic ordering unit (pieces)
Parameter
Parameter
Continuous
Pulsed
Taping
T106
3000
FE
Rth(ch-a)
Symbol
Symbol
V
V
Tstg
Tch
I
P
DSS
GSS
I
DP
D
D
∗1
∗2
−55 to +150
Limits
Limits
±300
±1.2
200
150
625
±12
30
1/4
(1) Source
(2) Gate
(3) Drain
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
Dimensions (Unit : mm)
UMT3
Inner circuit
°C/W
Unit
Unit
mW
mA
(2)
°C
°C
V
V
A
∗1
Abbreviated symbol : LP
0.65
( 3 )
( 2 )
2.0
1.3
0.65
(3)
(1)
0.3
( 1 )
Each lead has same dimensions
0.2
(1)
(2)
(3)
∗2
0.15
0.9
0.7
Source
Gate
Drain
2009.03 - Rev.A

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RJU003N03T106 Summary of contents

Page 1

Drive Nch MOSFET RJU003N03 Structure Silicon N-channel MOSFET Features 1) Low On-resistance. 2) Low voltage drive (2.5V drive). Applications Switching Packaging specifications and h FE Package Taping Type Code T106 3000 Basic ordering unit (pieces) RJU003N03 Absolute maximum ratings ...

Page 2

RJU003N03 Electrical characteristics (Ta=25°C) Parameter Symbol Gate-source leakage I GSS Drain-source breakdown voltage V (BR) DSS Zero gate voltage drain current I DSS Gate threshold voltage V GS (th) Static drain-source on-state ∗ (on) resistance ∗ Forward transfer ...

Page 3

RJU003N03 Electrical characteristics curves 0 10V 4.5V 0. 4.0V Ta=25°C GS Pulsed 0 1. 1. 1. 1.2V GS ...

Page 4

RJU003N03 10000 Ta=25°C t (off 15V 4.0V 1000 GS R =10Ω G Pulsed 100 t t (on 0.001 0.01 0.1 DRAIN-CURRENT : I [A] D Fig.10 Switching Characteristics 10 ...

Page 5

Appendix No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the ...

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