IRF6645 International Rectifier, IRF6645 Datasheet

MOSFET N-CH 100V DIRECTFET-SJ

IRF6645

Manufacturer Part Number
IRF6645
Description
MOSFET N-CH 100V DIRECTFET-SJ
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF6645

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
35 mOhm @ 5.7A, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
5.7A
Vgs(th) (max) @ Id
4.9V @ 50µA
Gate Charge (qg) @ Vgs
20nC @ 10V
Input Capacitance (ciss) @ Vds
890pF @ 25V
Power - Max
3W
Mounting Type
Surface Mount
Package / Case
DirectFET™ Isometric SJ
Configuration
Single Quad Drain Dual Source
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
35 mOhms
Drain-source Breakdown Voltage
100 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
5.7 A
Power Dissipation
3 W
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Fall Time
5.1 ns
Minimum Operating Temperature
- 40 C
Rise Time
5 ns
Lead Free Status / Rohs Status
No

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Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)

ƒ
Description
The IRF6645 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET
lowest on-state resistance in a package that has the footprint of an Micro8 and only 0.7 mm profile. The DirectFET package is compatible with
existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques,
when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided
cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
The IRF6645 is optimized for primary side bridge topologies in isolated DC-DC applications, for wide range universal input Telecom applications
(36V - 75V), and for secondary side synchronous rectification in regulated DC-DC topologies. The reduced total losses in the device coupled
with the high level of thermal performance enables high efficiency and low temperatures, which are key for system reliability improvements,
and makes this device ideal for high performance isolated DC-DC converters.
www.irf.com
V
V
I
I
I
I
E
I
Absolute Maximum Ratings
D
D
D
DM
AR
DS
GS
AS
RoHs Compliant Containing No Lead and Bromide 
Dual Sided Cooling Compatible 
Ideal for High Performance Isolated Converter
Primary Switch Socket
Optimized for Synchronous Rectification
Compatible with existing Surface Mount Techniques 
Low Profile (<0.7 mm)
Ultra Low Package Inductance
Optimized for High Frequency Switching 
Low Conduction Losses
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
@ T
@ T
@ T
SH
A
A
C
= 25°C
= 70°C
= 25°C
80
70
60
50
40
30
20
4
Fig 1. Typical On-Resistance vs. Gate Voltage
SJ
V GS , Gate-to-Source Voltage (V)
6
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Single Pulse Avalanche Energy
Avalanche Current
8
SP
10
12
T J = 25°C
Ãg
T J = 125°C
I D = 3.4A
g
Parameter
14
GS
GS
GS
MZ
@ 10V
@ 10V
@ 10V
16
h
f
MN
T
Repetitive rating; pulse width limited by max. junction temperature.
Starting T
C
measured with thermocouple mounted to top (Drain) of part.
Fig 2. Typical Total Gate Charge vs. Gate-to-Source Voltage
12
10

8
6
4
2
0
J
= 25°C, L = 5.0mH, R
0
I D = 3.4A
100V max ±20V max
DirectFET™ Power MOSFET ‚
Q
V
SJ
14nC
Q G Total Gate Charge (nC)
g tot
DSS
4
Max.
100
V DS = 80V
VDS= 50V
±20
5.7
4.5
3.4
25
45
29
G
4.8nC
= 25Ω, I
8
V
Q
TM
GS
gd
IRF6645
packaging to achieve the
DirectFET™ ISOMETRIC
AS
12
= 3.4A.
28mΩ@ 10V
R
V
4.0V
DS(on)
gs(th)
Units
16
mJ
V
A
A
8/5/05
1

Related parts for IRF6645

IRF6645 Summary of contents

Page 1

... The IRF6645 is optimized for primary side bridge topologies in isolated DC-DC applications, for wide range universal input Telecom applications (36V - 75V), and for secondary side synchronous rectification in regulated DC-DC topologies. The reduced total losses in the device coupled with the high level of thermal performance enables high efficiency and low temperatures, which are key for system reliability improvements, and makes this device ideal for high performance isolated DC-DC converters ...

Page 2

... IRF6645 Electrical Characteristic @ T Parameter BV Drain-to-Source Breakdown Voltage DSS ∆ΒV /∆T Breakdown Voltage Temp. Coefficient DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) ∆V /∆T Gate Threshold Voltage Coefficient GS(th Drain-to-Source Leakage Current DSS I Gate-to-Source Forward Leakage GSS Gate-to-Source Reverse Leakage ...

Page 3

... Rectangular Pulse Duration (sec) „ T measured with thermocouple incontact with top (Drain) of part. C … measured at θ ƒ small clip heatsink (still air) IRF6645 Max. 3.0 1.4 42 270 - 150 Typ. Max. ––– 58 12.5 ––– 20 ––– ...

Page 4

... IRF6645 100 10 6.0V 1 ≤60µs PULSE WIDTH Tj = 25°C 0.1 0 Drain-to-Source Voltage (V) Fig 4. Typical Output Characteristics 100 10V ≤60µs PULSE WIDTH 150° 25° -40°C 1 0.1 4.0 5.0 6 Gate-to-Source Voltage (V) Fig 6. Typical Transfer Characteristics 10000 0V MHZ C iss = SHORTED C rss = C gd ...

Page 5

... Fig11. Maximum Safe Operating Area 100 125 150 120 TOP 100 BOTTOM 100 Starting Junction Temperature (°C) IRF6645 1000 OPERATION IN THIS AREA LIMITED (on) 100 100µsec 10 1msec 25° 150°C 10msec Single Pulse 0.1 0.1 1.0 10 Drain-toSource Voltage (V) 6.0 5.5 5 ...

Page 6

... IRF6645 Current Regulator Same Type as D.U.T. 50KΩ .2µF 12V .3µ 3mA I G Current Sampling Resistors Fig 15a. Gate Charge Test Circuit D.U 20V GS 0.01 Ω Fig 16b. Unclamped Inductive Test Circuit ≤ 1 ≤ 0.1 % Fig 17a. Switching Time Test Circuit ...

Page 7

... Driver Gate Drive P.W. D.U.T. I Reverse Recovery „ Current - + D.U.T. V Re-Applied G + Voltage - Inductor Curent ® HEXFET Power MOSFETs P.W. Period D = Period Waveform SD Body Diode Forward Current di/dt Waveform DS Diode Recovery dv/dt Body Diode Forward Drop Ripple ≤ 5% for N-Channel D D IRF6645 V =10V ...

Page 8

... IRF6645 DirectFET™ Outline Dimension, SJ Outline (Small Size Can, J-Designation). Please see DirectFET application note AN-1035 for all details regarding the assembly of DirectFET. This includes all recommendations for stencil and substrate designs. DirectFET™ Part Marking 8 DIMENSIONS METRIC IMPERIAL CODE MAX ...

Page 9

... DirectFET™ Tape & Reel Dimension (Showing component orientation). IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 www.irf.com NOTE: Controlling dimensions in mm Std reel quantity is 4800 parts. (ordered as IRF6645). For 1000 parts on 7" reel, order IRF6645TR1 REEL DIMENSIONS STANDARD OPTION (QTY 4800) ...

Page 10

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...

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