NTS4173PT1G ON Semiconductor, NTS4173PT1G Datasheet

MOSFET P-CH 30V 1.2A SC70-3

NTS4173PT1G

Manufacturer Part Number
NTS4173PT1G
Description
MOSFET P-CH 30V 1.2A SC70-3
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTS4173PT1G

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
150 mOhm @ 1.2A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
1.2A
Vgs(th) (max) @ Id
1.5V @ 250µA
Gate Charge (qg) @ Vgs
10.1nC @ 10V
Input Capacitance (ciss) @ Vds
430pF @ 15V
Power - Max
290mW
Mounting Type
Surface Mount
Package / Case
SC-70-3, SOT-323-3
Configuration
Single
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
0.15 Ohm @ 10 V
Forward Transconductance Gfs (max / Min)
3.6 S
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
+/- 12 V
Continuous Drain Current
1.2 A
Power Dissipation
350 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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NTS4173PT1G
Quantity:
70
NTS4173P
Power MOSFET
−30 V, −1.3 A, Single P−Channel, SC−70
Features
Applications
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2008
September, 2008 − Rev. 0
THERMAL RESISTANCE RATINGS
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Pulsed Drain Current
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
Junction−to−Ambient − Steady State (Note 1)
Junction−to−Ambient − t ≤ 5 s (Note 1)
−30 V BV
Low Threshold Voltage
Fast Switching Speed
This is a Halide−Free Device
This is a Pb−Free Device
Load Switch
Low Current Inverter and DC−DC Converters
Power Switch for Printers, Communication Equipment
[2 oz] including traces)
ds
, Low R
Parameter
Parameter
(T
DS(on)
J
Steady
State
t ≤ 5 s
Steady
State
t ≤ 5 s
= 25°C unless otherwise noted)
in SC−70 Package
t
p
= 10 ms
T
T
T
T
A
A
A
A
= 25°C
= 85°C
= 25°C
= 25°C
Symbol
Symbol
V
R
R
V
I
T
P
T
DSS
T
I
DM
I
stg
qJA
qJA
GS
D
S
J
D
L
,
−55 to
Value
−0.80
−1.2
−1.3
0.29
0.35
−5.0
−1.0
Max
−30
±12
150
260
425
360
1
°C/W
Unit
Unit
°C
°C
W
V
V
A
A
A
†For information on tape and reel specifications,
* Date code orientation may vary depending upon
manufacturing location
NTS4173PT1G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
V
SC−70/SOT−323
Device
(BR)DSS
−30 V
1
CASE 419
STYLE 8
TG
M
G
(Note: Microdot may be in either location)
SC−70/SOT−323 (3 LEADS)
ORDERING INFORMATION
2
G
http://onsemi.com
3
200 mW @ −4.5 V
280 mW @ −2.5 V
150 mW @ −10 V
= Specific Device Code
= Date Code*
= Pb−Free Package
R
(Pb−Free)
Package
DS(on)
SC−70
S
MARKING DIAGRAM/
Publication Order Number:
PIN ASSIGNMENT
Gate
MAX
1
D
TGMG
3000/Tape & Reel
G
Shipping
3 Drain
NTS4173P/D
Source
I
D
−1.2 A
−1.0 A
−0.9 A
2
MAX

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NTS4173PT1G Summary of contents

Page 1

... I −1 260 °C L Device Symbol Max Unit NTS4173PT1G R 425 °C/W qJA R 360 qJA †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. * Date code orientation may vary depending upon ...

Page 2

MOSFET ELECTRICAL CHARACTERISTICS Parameter OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage Zero Gate Voltage Drain Current Gate−to−Source Leakage Current ON CHARACTERISTICS (Note 3) Gate Threshold Voltage Drain−to−Source On−Resistance Forward Transconductance CHARGES, CAPACITANCES AND GATE RESISTANCE Input Capacitance Output Capacitance Reverse Transfer Capacitance ...

Page 3

V 4.5 −4 4.0 J −3.0 V 3.5 3.0 2.5 2.0 1.5 1.0 0 0.5 1.0 1.5 −V , DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 1. On−Region Characteristics 0.30 0.25 0.20 0.15 0.10 0.05 2 ...

Page 4

C iss 400 300 200 C oss 100 C rss −V , DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 7. Capacitance Variation 100 V = −4 − ...

Page 5

TYPICAL PERFORMANCE CURVES 10 1.0 V SINGLE PULSE 0.1 T 0.01 0.1 Figure 13. Maximum Rated Forward Biased 1.0 0.5 0.2 0.1 0.1 0.05 0.02 0.01 Single Pulse 0.01 0.0001 0.001 0.01 = − 25° ...

Page 6

... A1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...

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