NTGS5120PT1G ON Semiconductor, NTGS5120PT1G Datasheet - Page 5

MOSFET P-CH 60V 1.8A 6-TSOP

NTGS5120PT1G

Manufacturer Part Number
NTGS5120PT1G
Description
MOSFET P-CH 60V 1.8A 6-TSOP
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTGS5120PT1G

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
111 mOhm @ 2.9A, 10V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
1.8A
Vgs(th) (max) @ Id
3V @ 250µA
Gate Charge (qg) @ Vgs
18.1nC @ 10V
Input Capacitance (ciss) @ Vds
942pF @ 30V
Power - Max
600mW
Mounting Type
Surface Mount
Package / Case
SC-74-6
Configuration
Single Quad Drain
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
0.111 Ohm @ 10 V
Drain-source Breakdown Voltage
60 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
2.5 A
Power Dissipation
1400 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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0
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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0.075
*For additional information on our Pb−Free strategy and soldering
1.9
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.05 (0.002)
0.037
0.037
0.95
0.95
H
SOLDERING FOOTPRINT*
E
e
A1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
6
1
D
5
2
0.094
2.4
3
4
b
0.039
1.0
A
E
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
SCALE 10:1
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
0.028
http://onsemi.com
L
0.7
CASE 318G−02
ISSUE S
TSOP−6
inches
mm
c
5
q
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. DIMENSIONS A AND B DO NOT INCLUDE
STYLE 1:
DIM
PIN 1. DRAIN
H
A1
ANSI Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
A
b
D
E
L
q
c
e
E
2. DRAIN
3. GATE
4. SOURCE
5. DRAIN
6. DRAIN
MIN
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
MILLIMETERS
NOM
1.00
0.06
0.38
0.18
3.00
1.50
0.95
0.40
2.75
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
1.10
0.10
0.50
0.26
3.10
1.70
1.05
0.60
3.00
10°
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
MIN
NTGS5120P/D
INCHES
0.039
0.002
0.014
0.007
0.059
0.037
0.016
0.108
NOM
0.118
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
MAX
10°

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