MTP23P06VG ON Semiconductor, MTP23P06VG Datasheet

MOSFET P-CH 60V 23A TO220AB

MTP23P06VG

Manufacturer Part Number
MTP23P06VG
Description
MOSFET P-CH 60V 23A TO220AB
Manufacturer
ON Semiconductor
Datasheet

Specifications of MTP23P06VG

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
120 mOhm @ 11.5A, 10V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
23A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
50nC @ 10V
Input Capacitance (ciss) @ Vds
1620pF @ 25V
Power - Max
90W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Configuration
Single
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
0.12 Ohms
Forward Transconductance Gfs (max / Min)
11.5 S
Drain-source Breakdown Voltage
- 60 V
Gate-source Breakdown Voltage
+/- 15 V
Continuous Drain Current
23 A
Power Dissipation
90 W
Maximum Operating Temperature
+ 175 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MTP23P06VGOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MTP23P06VG
Manufacturer:
ON
Quantity:
13 600
MTP23P06V
Power MOSFET
23 Amps, 60 Volts
P−Channel TO−220
avalanche and commutation modes. Designed for low voltage, high
speed switching applications in power supplies, converters and power
motor controls, these devices are particularly well suited for bridge
circuits where diode speed and commutating safe operating areas are
critical and offer additional safety margin against unexpected voltage
transients.
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 4
MAXIMUM RATINGS
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Drain−to−Source Voltage
Drain−to−Gate Voltage (R
Gate−to−Source Voltage
− Continuous
− Non−repetitive (t
Drain Current − Continuous @ 25°C
Drain Current
Drain Current
Total Power Dissipation @ 25°C
Derate above 25°C
Operating and Storage Temperature Range
Single Pulse Drain−to−Source Avalanche
Energy − Starting T
(V
I
Thermal Resistance − Junction−to−Case
Thermal Resistance
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from Case for 10 seconds
L
This Power MOSFET is designed to withstand high energy in the
Avalanche Energy Specified
I
Pb−Free Package is Available*
DD
= 23 Apk, L = 3.0 mH, R
DSS
= 25 Vdc, V
and V
DS(on)
− Continuous @ 100°C
− Single Pulse (t
GS
Rating
p
J
≤ 10 ms)
= 10 Vdc, Peak
− Junction−to−Ambient
= 25°C
Specified at Elevated Temperature
(T
GS
G
C
= 25 W)
= 25°C unless otherwise noted)
= 1.0 MW)
Preferred Device
p
≤ 10 ms)
Symbol
T
V
V
V
R
R
J
V
E
I
DGR
GSM
P
, T
DSS
DM
T
I
I
qJC
qJA
GS
AS
D
D
D
L
stg
−55 to 175
Value
± 15
± 25
0.60
1.67
62.5
794
260
60
60
23
15
81
90
1
W/°C
°C/W
Unit
Vdc
Vdc
Vdc
Vpk
Adc
Apk
mJ
°C
°C
W
MTP23P06V
MTP23P06VG
Preferred devices are recommended choices for future use
and best overall value.
1
2
Device
3
23 AMPERES, 60 VOLTS
MTP23P06V = Device Code
A
Y
WW
G
ORDERING INFORMATION
4
G
R
DS(on)
http://onsemi.com
CASE 221A
TO−220AB
STYLE 5
TO−220AB
TO−220AB
(Pb−Free)
P−Channel
Package
= Location Code
= Year
= Work Week
= Pb−Free Package
D
AND PIN ASSIGNMENT
= 120 mW
MARKING DIAGRAM
Publication Order Number:
Gate
S
1
23P06VG
AYWW
Drain
Drain
MTP
50 Units/Rail
50 Units/Rail
4
2
MTP23P06V/D
Shipping
3
Source

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MTP23P06VG Summary of contents

Page 1

... E 794 mJ AS °C/W R 1.67 qJC 62.5 R qJA °C T 260 L Device MTP23P06V MTP23P06VG Preferred devices are recommended choices for future use and best overall value. 1 http://onsemi.com 23 AMPERES, 60 VOLTS R = 120 mW DS(on) P−Channel MARKING DIAGRAM AND PIN ASSIGNMENT 4 4 Drain TO−220AB ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Drain−Source Breakdown Voltage ( Vdc 0.25 mAdc Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( Vdc Vdc Vdc, ...

Page 3

TYPICAL ELECTRICAL CHARACTERISTICS 10V T = 25° DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 1. On−Region Characteristics 0. ...

Page 4

Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals (Dt) are determined by how fast the FET input capacitance can be charged by current from the ...

Page 5

TOTAL GATE CHARGE (nC) g Figure 8. Gate−To−Source and Drain−To−Source Voltage versus Total Charge DRAIN−TO−SOURCE ...

Page 6

SINGLE PULSE T = 25°C C 100 LIMIT DS(on) THERMAL LIMIT PACKAGE LIMIT 0.1 0 DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 11. Maximum ...

Page 7

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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